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FinFets,semiconductor

  • Circuit Design Trends: 3D-ICs Extend Scaling

    Nearly 20 years after Mark Bohr's shot heard-round-the-world on interconnect scaling and circuit design, Paul Franzon is trying to sound the all-clear. Sort of. Bohr, you'll recall, stood up at the International Electron Devices Meeting and presented his famous circuit design paper " Interconnect...
    Posted to The Fuller View (Weblog) by Brian Fuller on Tue, Jul 30 2013
  • TSMC Forum: An Update on 20nm, 3D-IC, and 16nm FinFETs

    TSMC, the world's largest semiconductor foundry, is thinking big when it comes to next-generation process technology. At the TSMC Open Innovation Platform (OIP) Ecosystem Forum Oct. 16, TSMC described reference flows for 20nm and for multi-die integration, and revealed that ARM and TSMC are working...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 17 2012
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