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FinFET,Cortex-A7

10nm and 14nm FinFETs Pose Challenges – But Collaboration Brings Solutions

10nm and 14nm FinFET design will have a lot of challenges, but collaboration among semiconductor ecosystem partners is finding solutions, according to a presentation given at the Common Platform Technology Forum Feb. 5, 2013. The presentation was given by Vassilios Gerousis (right), distinguished engineer...

Posted to Industry Insights (Weblog) by rgoering on Tue, Feb 12 2013
Common Platform Forum Keynotes: 14nm FinFETs and Beyond

How far can we continue to scale semiconductors? 14nm FinFET technology is the next major move, but that's far from the end of the story, according to keynote speakers at the Common Platform Technology Forum in Santa Clara, California Feb. 5, 2013. The keynotes, still available for on-line viewing...

Posted to Industry Insights (Weblog) by rgoering on Wed, Feb 6 2013
Cadence, ARM, Samsung 14nm Test Chip – Collaboration Eases FinFET Digital Implementation

A recent test chip tapeout using the Samsung 14nm FinFET process revealed significant progress in digital implementation at this new process node. Thanks to deep collaboration and extensive R&D investments in libraries, process, and tools, the digital implementation of the test chip was successfully...

Posted to Industry Insights (Weblog) by rgoering on Mon, Jan 7 2013

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FinFET,Cortex-A7

10nm and 14nm FinFETs Pose Challenges – But Collaboration Brings Solutions

Common Platform Forum Keynotes: 14nm FinFETs and Beyond

Cadence, ARM, Samsung 14nm Test Chip – Collaboration Eases FinFET Digital Implementation

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