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Encounter,silicon realization

Place and route on SOC encounter

Hello, I am a newbie at place and route operation. Can anyone please tell me how do you make sure that all the blockes i your design are arranged in a certain way while doing place and route . I mean I have like around 300 odd blockes to be eranged and I want them to be ordered row wise and column wise...

Posted to Digital Implementation (Forum) by amythpai on Sun, Mar 17 2013
Via Placement issue.

Hi every one, I'm Lakshmi Prashanth, and i'm new to this encounter tool, I've got a problem., initially when i was moving the PG net over the Macros, tool was automatically placing the via's, But suddenly yesterday, some via's are deleted automatically, I don't know how, and If...

Posted to Digital Implementation (Forum) by Leader on Tue, Feb 12 2013
Cadence-ARM Collaboration Brings Optimized Tools to SoC Designers

Cadence and ARM have been working closely together for several years, and that relationship reached a new milestone Oct. 18 with the joint announcement of the first 20nm tapeout using the Cortex-A15 MPCore processor. The announcement also brought news of a multi-year technology collaboration that will...

Posted to Industry Insights (Weblog) by rgoering on Tue, Oct 18 2011
Why Cadence Bought Azuro – A Closer Look

Cadence announced July 12 its acquisition of Azuro , a provider of "clock concurrent optimization technology" (ccopt). But why, given that Cadence already has clock tree synthesis inside the Encounter Digital Implementation Platform? The answer is that Azuro technology goes far beyond clock...

Posted to Industry Insights (Weblog) by rgoering on Sun, Jul 24 2011
28 nm IC Design: The Devil Is In The Details

Smaller process technologies are enticing chip makers with bigger rewards from their end products. The shorter gate lengths at 28nm promise faster transistor speeds and less leakage power, and can double the amount of the logic that can be put into the same die area. Most importantly, however, more die...

Posted to Digital Implementation (Weblog) by Nora on Mon, Mar 14 2011
Tackling your Greatest Chip Design Challenges with the Cadence Digital End-to-End Flow

It hasn't been that long, but do you recall your new year's resolution? Eat healthier? Have more work-life balance? Exercise more? Or, what about, "create a chip that is so compelling and useful, it blows everybody's socks off in the semiconductor industry?" If the latter is your...

Posted to Digital Implementation (Weblog) by Design4Life on Mon, Jan 31 2011
New Silicon Realization Design Methodology Boosts 3D ICs With TSVs

Cadence this week (Jan. 31) is announcing a "unified" 3D IC design methodology that drives creation, implementation, and verification across the digital, analog, and packaging domains. It's part of a larger announcement of a digital end-to-end flow. What follows are some more details on...

Posted to Industry Insights (Weblog) by rgoering on Mon, Jan 31 2011
Problems Importing OA Design from Virtuoso into Encounter

Hello, While trying to perform place and route using Encounter I'm "encountering" errors importing my design from Virtuoso. When I try to import the design, I get the following: Reading tech data from OA Library 'NCL' ... FE units: 0.001 microns/dbu, OA units: 0.001 microns/dbu...

Posted to Digital Implementation (Forum) by TruLogic on Mon, Jan 10 2011

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Encounter,silicon realization

Place and route on SOC encounter

Via Placement issue.

Cadence-ARM Collaboration Brings Optimized Tools to SoC Designers

Why Cadence Bought Azuro – A Closer Look

28 nm IC Design: The Devil Is In The Details

Tackling your Greatest Chip Design Challenges with the Cadence Digital End-to-End Flow

New Silicon Realization Design Methodology Boosts 3D ICs With TSVs

Problems Importing OA Design from Virtuoso into Encounter