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Encounter,routing

  • Place and route on SOC encounter
    Hello, I am a newbie at place and route operation. Can anyone please tell me how do you make sure that all the blockes i your design are arranged in a certain way while doing place and route . I mean I have like around 300 odd blockes to be eranged and I want them to be ordered row wise and column wise...
    Posted to Digital Implementation (Forum) by amythpai on Sun, Mar 17 2013

  • Via Placement issue.
    Hi every one, I'm Lakshmi Prashanth, and i'm new to this encounter tool, I've got a problem., initially when i was moving the PG net over the Macros, tool was automatically placing the via's, But suddenly yesterday, some via's are deleted automatically, I don't know how, and If...
    Posted to Digital Implementation (Forum) by Leader on Tue, Feb 12 2013

  • 10nm and 14nm FinFETs Pose Challenges – But Collaboration Brings Solutions
    10nm and 14nm FinFET design will have a lot of challenges, but collaboration among semiconductor ecosystem partners is finding solutions, according to a presentation given at the Common Platform Technology Forum Feb. 5, 2013. The presentation was given by Vassilios Gerousis (right), distinguished engineer...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Feb 12 2013

  • NanoRoute doesn't route multi height design
    Hello, as a test case I have a mixed design with 4 rows only. 3 standard core cell rows and 1 second row, that has a multiple of standard cell row height & pitch. Site definition is done properly. The design contains 2 cells only, one per each row. I created the floorplan, defined the globalNetConnect...
    Posted to Digital Implementation (Forum) by scudex on Wed, Feb 6 2013

  • ARM Blog Tells Story of a 20nm Cortex-M0 Test Chip
    All 20nm test chips are learning experiences, and a recent tapeout of a 20nm Cortex-M0 test chip by ARM engineers was no exception. Completed in June 2012, the test chip design used a Cadence digital implementation flow. The story of the test chip is told in a new guest partner blog (I'm the "guest"...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Nov 27 2012

  • ARM TechCon: Inside Story of a 14nm FinFET Tapeout
    The next frontier in semiconductor design is the 14nm process node, and it will come with a new type of transistor, the FinFET. 14nm FinFET technology moved closer to reality at the ARM TechCon conference Oct. 30, 2012, where a Cadence sponsored technical session announced a 14nm test chip tapeout using...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 31 2012

  • 10 Encounter Tips and Tricks You May Not Be Aware Of
    In looking over the shoulders of Encounter users over the years I've found there's a bunch of little tips and tricks I use to make interacting with the tool a little easier that aren't necessarily immediately obvious. Here are some of the more common ones I used this week: When navigating...
    Posted to Digital Implementation (Weblog) by BobD on Fri, Jul 27 2012

  • Cadence, Samsung Detail 20nm RTL-to-GDSII Methodology
    In a recently archived May 2 webinar , speakers from Cadence and Samsung described a 20nm digital design methodology that can manage challenges such as double patterning, variability, and complexity. The webinar discussed EDA tools, physical IP, and 20nm process technologies, and it highlighted a "proof...
    Posted to Industry Insights (Weblog) by rgoering on Mon, May 7 2012

  • CDNLive! – IBM Expert Quantifies Design Impact of Double Patterning
    Double patterning will be an essential lithographic technique for ICs at 20nm and below. The more we can understand it, and quantify its impacts on the design flow, the easier it will be to adopt. A good step towards that understanding was taken at CDNLive! Silicon Valley 2012 (the recent Cadence user...
    Posted to Industry Insights (Weblog) by rgoering on Sun, Apr 1 2012

  • Three Die Stack -- A Big Step “Up” for 3D-ICs with TSVs
    A major advancement in 3D-IC through-silicon via (TSV) design will be unveiled Tuesday (Dec. 13) as representatives of CEA-LETI and ST-Ericsson describe the development of a three-die stack with wide I/O memory and logic. This tapeout is the result of a collaboration between these two organizations and...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Dec 13 2011
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