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Encounter,power
2.5D
28HPM
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Panel: 3D-IC Design Experts Tackle “Practical Issues” in 2.5D and 3D TSV Deployment
3D-IC technology has gone from the "grandiose plans" of several years ago to the "practical issues" of ramping up for widespread deployment, according to one panelist at the Electronic Design Process Symposium (EDPS) April 18, 2013 in Monterey, California. That's a pretty good...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Tue, Apr 23 2013
Place and route on SOC encounter
Hello, I am a newbie at place and route operation. Can anyone please tell me how do you make sure that all the blockes i your design are arranged in a certain way while doing place and route . I mean I have like around 300 odd blockes to be eranged and I want them to be ordered row wise and column wise...
Posted to
Digital Implementation
(Forum)
by
amythpai
on Sun, Mar 17 2013
Via Placement issue.
Hi every one, I'm Lakshmi Prashanth, and i'm new to this encounter tool, I've got a problem., initially when i was moving the PG net over the Macros, tool was automatically placing the via's, But suddenly yesterday, some via's are deleted automatically, I don't know how, and If...
Posted to
Digital Implementation
(Forum)
by
Leader
on Tue, Feb 12 2013
ARM and Cadence Improve Cortex-A Power and Performance with Optimized Flow
For several years, ARM has offered processor optimization utilities (called POPs) that help users of ARM Cortex-A series processors optimize power, performance and area for a given process. This week (Aug. 9) ARM and Cadence took things one step further by announcing a POP that includes scripts that...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Aug 9 2012
Webinar Report: Solving Mixed-Signal Power Grid Challenges
Complex analog/mixed-signal ICs pose many power grid design and analysis challenges. Unanticipated IR drop and electromigration problems are commonplace, and they significantly impact circuit behavior. But as a recently archived webinar shows, there are a number of ways to minimize these problems, even...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, Jan 11 2012
Three Die Stack -- A Big Step “Up” for 3D-ICs with TSVs
A major advancement in 3D-IC through-silicon via (TSV) design will be unveiled Tuesday (Dec. 13) as representatives of CEA-LETI and ST-Ericsson describe the development of a three-die stack with wide I/O memory and logic. This tapeout is the result of a collaboration between these two organizations and...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Tue, Dec 13 2011
User View: Low Power Challenges at 40nm and Below
Low power design is hard enough at 65nm and above, and it poses additional challenges at 40nm and below, according to Alex Kuo, department manager at SoC design firm Global Unichip Corp. As noted in another Cadence Community blog post by Qi Wang, Kuo offered a presentation on low-power design at the...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Tue, Jun 21 2011
How to Control Power Switch Rush Current
While there are multiple techniques for reducing power consumption, shutting off power domains is the main method used to reduce leakage power consumption. In power shut-off designs, there are multiple aspects designers need to take care of, including IR drop, turn-on time, rush current, and the number...
Posted to
Low Power
(Weblog)
by
SunilVGokhale
on Wed, May 11 2011
Problems Importing OA Design from Virtuoso into Encounter
Hello, While trying to perform place and route using Encounter I'm "encountering" errors importing my design from Virtuoso. When I try to import the design, I get the following: Reading tech data from OA Library 'NCL' ... FE units: 0.001 microns/dbu, OA units: 0.001 microns/dbu...
Posted to
Digital Implementation
(Forum)
by
TruLogic
on Mon, Jan 10 2011
User Interview: How To Estimate Power Early
Early power estimation makes it much easier to manage IC power, according to Camille Kokozaki, director of design automation services at Integrated Device Technology ( IDT ). At the recent CDNLive! Silicon Valley , he presented a case study of architectural power estimation with a 65nm system-on-chip...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Oct 29 2009
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