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Electronic Design Processes,EDPS,EDP

Electronic System Level (ESL) Design Gets a Pragmatic Look at EDPS Workshop

Presentations at the Electronic Design Process Symposium (EDPS) April 18, 2013 gave a realistic look at the promises and limitations of electronic system level (ESL) design. Speakers noted that ESL tools are used for the lower levels of the software stack, but typically not for applications development...

Posted to Industry Insights (Weblog) by rgoering on Sun, Apr 21 2013
Is System Modeling the Next EDA Abstraction Level?

According to a recent talk by Frank Schirrmeister, group director of product marketing for the Cadence System and Software Realization Group, the answer is "yes." System modeling is a level of abstraction that's independent from hardware and software implementation. But there are some interesting...

Posted to Industry Insights (Weblog) by rgoering on Sun, Apr 15 2012
EDA Symposium: How Wide I/O is Driving 3D-ICs with TSVs

Any new technology needs a driving force or "killer app," and 3D-ICs with through-silicon vias (TSVs) are no exception. By allowing a high-bandwidth, low-power connection between CPU and DRAM, the new JEDEC wide I/O mobile DRAM standard will be that driving force, according to Marc Greenberg...

Posted to Industry Insights (Weblog) by rgoering on Tue, Apr 10 2012
EDA Symposium: Users Cite 3D-IC Design Tool Needs

What's needed to bring 3D-ICs with through-silicon vias (TSVs) - or 2.5D ICs with silicon interposers - into the IC design mainstream and volume production? That question resonated through a day-long session on 3D-ICs at the Electronic Design Processes Symposium ( EDPS ) April 6, 2012 in Monterey...

Posted to Industry Insights (Weblog) by rgoering on Mon, Apr 9 2012
Join EDA “Movers and Shakers” at IEEE EDP Symposium – Cloud, 3D-ICs, Power and More

If you want a deeper understanding of the challenges, trends, and potential new solutions for IC and systems design, there's no better place to find out than the IEEE-sponsored Electronic Design Processes Symposium (EDP) April 5-6, 2012, in Monterey, California. Now in its 19 th year, this interactive...

Posted to Industry Insights (Weblog) by rgoering on Thu, Mar 8 2012

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Electronic Design Processes,EDPS,EDP

Electronic System Level (ESL) Design Gets a Pragmatic Look at EDPS Workshop

Is System Modeling the Next EDA Abstraction Level?

EDA Symposium: How Wide I/O is Driving 3D-ICs with TSVs

EDA Symposium: Users Cite 3D-IC Design Tool Needs

Join EDA “Movers and Shakers” at IEEE EDP Symposium – Cloud, 3D-ICs, Power and More