Log In
|
Register
|
Resource Library
|
Worldwide
Asia-Pacific
|
China
|
EMEA
|
India
|
Israel
|
Japan
|
Korea
|
Taiwan
|
Global Office Locator
Solutions
Products
Services
Support & Training
Alliances
Community
About Cadence
Solutions:
Design IP
Mixed-Signal
Low-Power
Advanced Node
3D-IC
Enterprise Verification
Hosted Design
System Development Suite
Solutions Home
Products for:
System Design and Verification
Functional Verification
Logic Design
Digital Implementation
Custom IC Design
RF Design
PCB Design
IC Packaging and SiP Design
Silicon Signoff and Verification
More Products
OrCAD Products
Sigrity Technologies
Design IP
Verification IP
IP Catalog
Products A-Z
Products Home
Capabilities and Practices
Methodology Services
Design Services
DFM Services
Educational Services
Programs
SOI Design Hub
Services Home
Support
Support Offerings
Support Process
Cadence Online Support
Software Downloads
Computing Platform Support
University Software Program
Training
Training Options
Training Course Catalogs
Support & Training Home
Programs and Initiatives
System Realization Alliance
Foundry Program
ChipEstimate.com - Chip Planning Portal
Connections Program
Verification Alliance Program
Channel Partner (VARs) Program
Power Forward Initiative
Standards and Languages
PCB Service Bureaus
Industry Memberships
Alliances Home
Communities
Industry Insights Blog
Low Power Blog
Mixed-Signal Design Blog
System Design and Verification
Cadence IP Blog
Functional Verification
Logic Design
Digital Implementation
Custom IC Design
RF Design
PCB Design
IC Packaging and SiP Design
Silicon Signoff and Verification
Quicklinks
All Blogs
All Forums
Community Search
CDNLive User Conferences
Community Home
EDA Vision
Visit the EDA360 microsite
News and Events:
Newsroom
Events and Webinars
Resources:
Customer Success
Newsletters
Publications
Multimedia Center
Logos
Company Info:
Investor Relations
Executive Team
Careers
Contact Us
About Cadence Home
Home
>
Community
>
Tags
> ETS/Encounter
Login with a Cadence account.
Not a member yet?
Create a permanent login account to make interactions with Cadence more conveniennt.
Register
|
Membership benefits
Get email delivery of the Cadence blog (individual posts).
Industry Insights
Low Power
Mixed-Signal Design
System Design
and Verification
Cadence IP Blog
Functional Verification
Logic Design
Digital Implementation
Custom IC Design
RF Design
PCB Design
IC Packaging and SiP Design
Silicon Signoff and Verification
All Blog Categories
Popular Tags
Allegro
Analog
cadence
DAC
Digital Implementation
e
EDA360
encounter
ESL
functional verification
Incisive
industry insights
IP
Low power
Mixed-Signal
OVM
PCB
PCB design
Specman
System Design and Verification
SystemC
TLM
UVM
verification
Virtuoso
Browse All Tags
Email
*
Required Fields
Recipients email
*
(separate multiple addresses with commas)
Your name
*
Your email
*
Message
*
Send yourself a copy
Share
Twitter
Facebook
LinkedIn
Google+
Subscribe
RSS
Cadence RSS Feeds
Cadence Press Releases
System Design and Verification Blog
Functional Verification Blog
Digital Implementation Blog
Custom IC Design Blog
RF Design Blog
PCB Design Blog
IC Packaging and SiP Design Blog
Manufacturability Signoff Blog
All Blogs
System Design and Verification Forum
Functional Verification Forum
Digital Implementation Forum
Custom IC Design Forum
Custom IC SKILL Forum
Logic Design Forum
RF Design Forum
PCB Design Forum
PCB SKILL Forum
IC Packaging and SiP Design Forum
Manufacturability Signoff Forum
Intro copy of the newsletter section here, some intro copy of the newsletter. Instruction of how to subscribe to this newsletter.
Contact Us
Cadence Contacts
Community Relations
Customer Support
Employment
Investor Relations
Media Relations
Training
Global Office Locator
Find Offices worldwide
»
Sales Inquiry
Request for Product information
»
Cadence Channel Partners
»
Corporate Headquarters
Cadence Design Systems, Inc.
2655 Seely Avenue
San Jose, CA 95134
Phone: 408.943.1234
*
Required Fields
First Name
*
Last Name
*
Email
*
Company / Institution
*
Comments:
*
Send Yourself A Copy
ETS,Encounter
14 nm
14nm
14nm tapeout
20 nm
20nm
3D
ARM
Cadence
CMOS
colorization
Cortex-A0
Cortex-A7
Cortex-M0
design rules
digital
digital implementation
dipole lithography
Double Patterning
DPT
ECO
ECO flow
ECO loops
EDI
electromigration
Encounter - verify_geometries
Encounter Power System
encounter test
encounter timing system
EPS
extraction
FinFET
FinFets
FlexColor
FPGA
hold
IBM
Industry Insights
interconnect
IP
LELE
Lin
mask misalignment
mask shift
MMMC
Molina
multi-mode multi-corner
physical IP
Physical Verification System
physically aware
placement
power network analysis
process corners
PVS
PVT corners
QRC
Router
routing
RTL Compiler
Ruben Molina
Samsung
sdf
setup
signoff
SPEF
STA
static timing analysis
Tan
tapeout
Techfile
test chip
timing signoff
via Connectivity
Virtuoso
webinar
Place and route on SOC encounter
Hello, I am a newbie at place and route operation. Can anyone please tell me how do you make sure that all the blockes i your design are arranged in a certain way while doing place and route . I mean I have like around 300 odd blockes to be eranged and I want them to be ordered row wise and column wise...
Posted to
Digital Implementation
(Forum)
by
amythpai
on Sun, Mar 17 2013
Re: Doubt regarding SDF
Thanks kari, But I have one doubt regarding this. I've used same max,min and typical lib for both encounter and ETS. So delay for each standard cells same in both encounter and ETS. Then Why we go for ETS to write sdf and timing optimization? If I'm wrong,correct me. Thanks, selvam.
Posted to
Digital Implementation
(Forum)
by
selvam27
on Wed, Mar 13 2013
Via Placement issue.
Hi every one, I'm Lakshmi Prashanth, and i'm new to this encounter tool, I've got a problem., initially when i was moving the PG net over the Macros, tool was automatically placing the via's, But suddenly yesterday, some via's are deleted automatically, I don't know how, and If...
Posted to
Digital Implementation
(Forum)
by
Leader
on Tue, Feb 12 2013
Cadence, ARM, Samsung 14nm Test Chip – Collaboration Eases FinFET Digital Implementation
A recent test chip tapeout using the Samsung 14nm FinFET process revealed significant progress in digital implementation at this new process node. Thanks to deep collaboration and extensive R&D investments in libraries, process, and tools, the digital implementation of the test chip was successfully...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, Jan 7 2013
Why Multi-Mode, Multi-Corner (MMMC) ECO Closure Requires a New Signoff Approach
In the semiconductor design flow, engineering change orders (ECOs) are as inevitable as death and taxes. While this has always been the case, ECO timing closure is becoming increasingly difficult as the number of operating modes and process-voltage- temperature (PVT) corners skyrockets. What's needed...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, Aug 6 2012
Doubt regarding SDF
What is the difference between writing sdf from encounter and from ETS? I had written sdf(write_sdf) from encounter after postRoute and also write sdf(write_sdf) in ETS using spef generated by encounter. I have doubt that What is the difference between writing sdf from encounter and from ETS?
Posted to
Digital Implementation
(Forum)
by
selvam27
on Fri, Jun 8 2012
Cadence, Samsung Detail 20nm RTL-to-GDSII Methodology
In a recently archived May 2 webinar , speakers from Cadence and Samsung described a 20nm digital design methodology that can manage challenges such as double patterning, variability, and complexity. The webinar discussed EDA tools, physical IP, and 20nm process technologies, and it highlighted a "proof...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, May 7 2012
Problems Importing OA Design from Virtuoso into Encounter
Hello, While trying to perform place and route using Encounter I'm "encountering" errors importing my design from Virtuoso. When I try to import the design, I get the following: Reading tech data from OA Library 'NCL' ... FE units: 0.001 microns/dbu, OA units: 0.001 microns/dbu...
Posted to
Digital Implementation
(Forum)
by
TruLogic
on Mon, Jan 10 2011
Do Foundation Flows also exist for EPS or ETS?
First post so please bear with me. We have seen posts, etc. about the encounter foundation flow. I have tried this and it works fairly well. Nice flow. While poking around in the ETS installation directory tree I found what appears to be foundation flows for EPS and ETS. Has anyone tried these either...
Posted to
Digital Implementation
(Forum)
by
pdgeek
on Tue, Oct 19 2010
Page 1 of 1 (9 items)