Log In
|
Register
|
Resource Library
|
Worldwide
Asia-Pacific
|
China
|
EMEA
|
India
|
Israel
|
Japan
|
Korea
|
Taiwan
|
Global Office Locator
Solutions
Products
Services
Support & Training
Alliances
Community
About Cadence
Solutions:
Design IP
Mixed-Signal
Low-Power
Advanced Node
3D-IC
Enterprise Verification
Hosted Design
System Development Suite
Solutions Home
Products for:
System Design and Verification
Functional Verification
Logic Design
Digital Implementation
Custom IC Design
RF Design
PCB Design
IC Packaging and SiP Design
Manufacturability Signoff
More Products
OrCAD Products
Sigrity Technologies
Design IP
Verification IP
IP Catalog
Products A-Z
Products Home
Capabilities and Practices
Methodology Services
Design Services
DFM Services
Educational Services
Programs
SOI Design Hub
Services Home
Support
Support Offerings
Support Process
Cadence Online Support
Software Downloads
Computing Platform Support
University Software Program
Training
Training Options
Training Course Catalogs
Support & Training Home
Programs and Initiatives
System Realization Alliance
Foundry Program
ChipEstimate.com - Chip Planning Portal
Connections Program
Verification Alliance Program
Channel Partner (VARs) Program
Power Forward Initiative
Standards and Languages
PCB Service Bureaus
Industry Memberships
Alliances Home
Communities
Industry Insights Blog
Low Power Blog
Mixed-Signal Design Blog
System Design and Verification
Cadence IP Blog
Functional Verification
Logic Design
Digital Implementation
Custom IC Design
RF Design
PCB Design
IC Packaging and SiP Design
Quicklinks
All Blogs
All Forums
Community Search
CDNLive User Conferences
Community Home
EDA Vision
Visit the EDA360 microsite
News and Events:
Newsroom
Events and Webinars
Resources:
Customer Success
Newsletters
Publications
Multimedia Center
Logos
Company Info:
Investor Relations
Executive Team
Careers
Contact Us
About Cadence Home
Home
>
Community
>
Tags
> ESL/Gary Smith
Login with a Cadence account.
Not a member yet?
Create a permanent login account to make interactions with Cadence more conveniennt.
Register
|
Membership benefits
Get email delivery of the Cadence blog (individual posts).
Industry Insights
Low Power
Mixed-Signal Design
System Design
and Verification
Cadence IP Blog
Functional Verification
Logic Design
Digital Implementation
Custom IC Design
RF Design
PCB Design
IC Packaging and SiP Design
Manufacturability Signoff
All Blog Categories
Popular Tags
Allegro
Analog
ARM
cadence
DAC
Digital Implementation
e
EDA360
encounter
ESL
functional verification
Incisive
industry insights
Low power
Mixed-Signal
OVM
PCB
PCB design
Specman
System Design and Verification
SystemC
TLM
UVM
Verification
Virtuoso
Browse All Tags
Email
*
Required Fields
Recipients email
*
(separate multiple addresses with commas)
Your name
*
Your email
*
Message
*
Send yourself a copy
Share
Twitter
Facebook
LinkedIn
Google+
Subscribe
RSS
Cadence RSS Feeds
Cadence Press Releases
System Design and Verification Blog
Functional Verification Blog
Digital Implementation Blog
Custom IC Design Blog
RF Design Blog
PCB Design Blog
IC Packaging and SiP Design Blog
Manufacturability Signoff Blog
All Blogs
System Design and Verification Forum
Functional Verification Forum
Digital Implementation Forum
Custom IC Design Forum
Custom IC SKILL Forum
Logic Design Forum
RF Design Forum
PCB Design Forum
PCB SKILL Forum
IC Packaging and SiP Design Forum
Manufacturability Signoff Forum
Intro copy of the newsletter section here, some intro copy of the newsletter. Instruction of how to subscribe to this newsletter.
Contact Us
Cadence Contacts
Community Relations
Customer Support
Employment
Investor Relations
Media Relations
Training
Global Office Locator
Find Offices worldwide
»
Sales Inquiry
Request for Product information
»
Cadence Channel Partners
»
Corporate Headquarters
Cadence Design Systems, Inc.
2655 Seely Avenue
San Jose, CA 95134
Phone: 408.943.1234
*
Required Fields
First Name
*
Last Name
*
Email
*
Company / Institution
*
Comments:
*
Send Yourself A Copy
ESL,Gary Smith
2011
3D IC
3D-IC
architects
architects workbench
architectural
ARM
C++
CAD methodologies
Cadence
chip planning
ChipEstimate.com
CPF
DAC 2011
DAC 2012
Dan Nenni
DATE
design collaboration
DesignCon
designer of the future
dynamic power analysis
EDA
EDA forecast
EDA revenues
EDA workshop
EDA360
EDP
EDP 2012
EDPS
EDPS 2013
Electronic Design Process
Electronic Design Processes
embedded
embedded software
emulation
ESL engineers
FinFET
Gary Smith EDA
hardware/software
hardware/software integration
High-level Synthesis
HLS
IEEE
Industry Insights
integration
Intel
IP
IP Reuse
Ivo Bolsens
LinkedIn
low power
Mathworks
MoC
modeling
models of computation
Monterey
multi-platform design
new class of engineer
OMAP
Palladium XP
platform
platform based design
Ptolemy
Qi Wang
RTL
Schirrmeister
SDKs
Silicon Hive
silicon virtual prototoype
silicon virtual prototype
skills
Snapdragon
SoC
SoC: EDA360
software
software development
software virtual prototype
SysML
System C
System Design and Verification
System Development Suite
system level
system level design
system modeling
system realization
SystemC
system-level
System-Level Design
TED Talks
Tegra
Tensilica
TLM
transaction level
TSMC
UML
UPF
virtual platforms
virtual prototype
virtual prototypes
Wang
Join EDA “Movers and Shakers” at Electronic Design Process Symposium (EDPS) April 18-19, 2013
If you're familiar with the popular, cutting-edge TED Talks lecture series, then I would call the Electronic Design Process Symposium ( EDPS ) the "TED Talks" of EDA. Now in its 20 th year, this IEEE-sponsored workshop brings together the thinkers, movers and shakers of IC and systems design...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, Mar 11 2013
Gary Smith at DAC 2012: Multi-Platform Design and the $40M System on Chip
Veteran EDA analyst Gary Smith started his annual Design Automation Conference ( DAC 2012 ) presentation with three simple words: "I was wrong." Wrong, that is, about last year's observation that it takes $75 million or more to design the average high-end mobile semiconductor design. Smith...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Sun, Jun 3 2012
System-Level Low Power Design – What Will it Take to Move There?
While many low-power design techniques are available to IC designers, the greatest potential for power savings is at the system level, where both software and hardware can be considered. So what's standing in the way of system-level low power design, and what needs to happen to make it practical...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, Apr 18 2012
Is System Modeling the Next EDA Abstraction Level?
According to a recent talk by Frank Schirrmeister, group director of product marketing for the Cadence System and Software Realization Group, the answer is "yes." System modeling is a level of abstraction that's independent from hardware and software implementation. But there are some interesting...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Sun, Apr 15 2012
Hot Topic Revisited: System-Level Design and a “New Class” of Engineer
Six months ago I wrote a blog post that considered the question, Is System-Level Design Creating a New Class of Engineer? Since then an ongoing discussion in the LinkedIn electronic system level (ESL) design group has added some new perspectives not considered in my original blog post. To quickly recap...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Oct 6 2011
Combating System-Level Design Confusion
I would like to add my thanks to Gary Smith for his short "Industry Note" titled " ESL Behavioral Design " that I first saw in a post by Steve Leibson . Yes, the note is pretty short and topic is pretty broad, but the diagram and definitions of Silicon Virtual Prototype (SVP) and...
Posted to
System Design and Verification
(Weblog)
by
jasona
on Mon, Apr 11 2011
Is System-Level Design Creating a New Class of Engineer?
The move to electronic system level (ESL) technologies such as virtual prototyping is well underway - but what's the impact on the engineering organization? A recent panel discussion and an industry note published by analyst Gary Smith both suggested that new engineering roles are evolving, and several...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Apr 7 2011
Panelists: “Designer of Future” Needs New Hardware, Software Skills
There's been much talk about the tools and methodologies needed for next-generation electronic systems design, but not so much about the people behind them. The people side of system-level design became clearer at a DesignCon panel titled "Who is the Designer of the Future?" One conclusion...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Sun, Feb 6 2011
Page 1 of 1 (8 items)