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EM

Five-Minute Tutorial: Create Encounter Power System (EPS) Power-Grid Views For Standard Cells

In today's tutorial, I'm giving you a sample EPS (Encounter Power System) script that you can use to generate power-grid views for your standard cells. Power-grid views are used during rail analysis, with IR-Drop and EM (electromigration/current density) being the two most popular analysis types...

Posted to Digital Implementation (Weblog) by Kari on Fri, Feb 22 2013
ARM TechCon: Design at 14nm (or 10nm) – What’s Going to Change

The next semiconductor process node after 20nm promises tremendous power and performance benefits, but also poses some new challenges, according to a presentation by ARM and IBM at the ARM TechCon conference Oct. 30, 2012. The presentation showed how the "second generation" of double patterning...

Posted to Industry Insights (Weblog) by rgoering on Fri, Nov 2 2012
ARM TechCon: Inside Story of a 14nm FinFET Tapeout

The next frontier in semiconductor design is the 14nm process node, and it will come with a new type of transistor, the FinFET. 14nm FinFET technology moved closer to reality at the ARM TechCon conference Oct. 30, 2012, where a Cadence sponsored technical session announced a 14nm test chip tapeout using...

Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 31 2012
Why Cadence Bought Sigrity – And How it May Change PCB Analysis

On July 2 Cadence announced its acquisition of Sigrity , a provider of signal integrity and power network analysis tools for PCB and IC package design. Cadence already has some technology in these areas, and many Allegro and OrCAD customers use Sigrity tools today. So why buy Sigrity, and why make this...

Posted to Industry Insights (Weblog) by rgoering on Thu, Jul 12 2012
Five-Minute Tutorial: Understanding the Encounter Power System (EPS) Reports Directory

No matter how you run your power analysis - with Encounter Power System (EPS) or from within Encounter Digital Implementation (EDI) System - you're probably familiar with the result directory. It will look something like VDD_125C_avg_1 and have lots of files inside. The first ones you probably look...

Posted to Digital Implementation (Weblog) by Kari on Tue, May 1 2012
Team Allegro to Preview PCB 3D Full-Wave Technology at EPEPS 2011

At the Electrical Performance of Electronic Packaging and Systems conference ( EPEPS 2011 ) in San Jose, Calif. Oct. 23-26, Cadence will demonstrate our latest technology developed for PCB multi-gigabit design and analysis. Join the buzz at Table 8 while the exhibits are open on Monday and Tuesday (10...

Posted to PCB Design (Weblog) by TeamAllegro on Fri, Oct 14 2011
What's Good About PCB SI Metal Surface Roughness? SPB16.3 Has Some New Enhancements!

Happy New Year! Electromagnetic Solution 2D (EMS2D) is designed for accurate transmission line parameter extraction over a full frequency range from DC up to the frequency of interest. However, this accuracy depends on an accurate and complete physical model provided to the solver by users. For example...

Posted to PCB Design (Weblog) by Jerry GenPart on Wed, Jan 5 2011

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EM

Five-Minute Tutorial: Create Encounter Power System (EPS) Power-Grid Views For Standard Cells

ARM TechCon: Design at 14nm (or 10nm) – What’s Going to Change

ARM TechCon: Inside Story of a 14nm FinFET Tapeout

Why Cadence Bought Sigrity – And How it May Change PCB Analysis

Five-Minute Tutorial: Understanding the Encounter Power System (EPS) Reports Directory

Team Allegro to Preview PCB 3D Full-Wave Technology at EPEPS 2011

What's Good About PCB SI Metal Surface Roughness? SPB16.3 Has Some New Enhancements!