Home > Community > Tags > EDN/SPB 16.2 release/IC Packaging and SiP Design
 
Login with a Cadence account.
Not a member yet?
Create a permanent login account to make interactions with Cadence more conveniennt.

Register | Membership benefits
Get email delivery of the Cadence blog (individual posts).
 

Email

* Required Fields

Recipients email * (separate multiple addresses with commas)

Your name *

Your email *

Message *

Contact Us

* Required Fields
First Name *

Last Name *

Email *

Company / Institution *

Comments: *

EDN,SPB 16.2 release,IC Packaging and SiP Design

  • EDN blogger talks about Allegro 16.2 release

    Of interest to readers of this forum. An EDN blogger today talks about our SPB 16.2 release. “Cadence is underlining the observation that no longer can we regard PCB design as somehow a simple process, and package design as a mechanical problem,” writes EDN executive Editor Ron Wilson. “With...
    Posted to IC Packaging and SiP Design (Forum) by Dieds on Mon, Aug 18 2008
Page 1 of 1 (1 items)