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EDA360,Open Integration Platform,Industry Insights

  • Sonics Interview: AMBA Interconnect IP In The Cloud

    Easier IP integration into systems-on-chip has been a long-sought goal, and is a key part of the EDA360 vision . In a Design Automation Conference interview, I learned how Sonics and Cadence are working together to provide an integration-optimized solution for AMBA interconnect IP. Sonics , a provider...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Aug 19 2010
  • Q and A: How SoC Realization Enables IP Integration

    Systems-on-chips (SoCs) are more than just silicon. In the EDA360 vision, SoC Realization refers to the development of complete SoCs along with "bare metal" (hardware dependent) software. In this interview Vishal Kapoor, vice president of product management at Cadence, describes SoC Realization...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jun 3 2010
  • Video: Customers Share Views Of EDA360

    When the Cadence EDA360 vision paper was released three weeks ago, two questions that arose were "what do the customers think" and "where are the technologies that will enable this." A short video from the recent CDNLive! EMEA conference in Munich, Germany presents some answers to...
    Posted to Industry Insights (Weblog) by rgoering on Tue, May 18 2010
  • Open Integration Platform – Redefining “Silicon” IP

    One of the most interesting features of the Cadence Open Integration Platform , introduced May 5 at the CDNLive! EMEA conference, is that it offers a new view of how silicon IP should be provided. In fact, the term "silicon IP" may have to be revised, because we're now talking about an...
    Posted to Industry Insights (Weblog) by rgoering on Thu, May 6 2010
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