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Digital SiP design

  • Cadence SiP and IC Packaging at DesignCon

    Those of you attending DesignCon in February should stop by the Cadence booth to see the latest integration of PakSi-E in SiP SI. This integration not only supports signal integrity, but also there is new package power integrity technology. We will also be showing techniques where Package-on-Package...
    Posted to IC Packaging and SiP (Weblog) by Maxwell86 on Fri, Jan 23 2009
  • TSV, mainstream or niche?

    I'm sure many of you will have read the article in Advanced Packaging click_here where the luminaries at Georgia-Tech talk about how TSV can take us to the next level of functional integration and miniaturization. I have heard several companies (foundries and some iDM's) talking about pilot projects...
    Posted to IC Packaging and SiP (Weblog) by SiPper on Wed, Sep 24 2008
  • PakSi-E "ocho" fuels Cadence Package SI solutions

    In case you haven't heard, Allegro Package SI and Cadence SiP SI solutions now work with the latest and greatest version of PakSi-E (Version 8.1) as an extraction engine. Check out the announcement from CDNLive! EMEA. http://www.apache-da.com/apache-da/Home/NewsandEvents/PressReleases/04.28.08.html
    Posted to IC Packaging and SiP (Weblog) by Maxwell86 on Sat, Jul 12 2008
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