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Digital Implementation,test

  • The Case for the Tiny Testcase

    I often joke with customers that, although I realize they have to work on large designs, I do my best work on designs with just 2 or 3 instances. That's because I'm often trying to replicate an issue they've observed on their design and I'm attempting to reproduce that behavior in a smaller...
    Posted to Digital Implementation (Weblog) by BobD on Fri, Nov 16 2012
  • 3D-IC TSV Realization: The Race Has Begun!

    3D IC discussions are creating quite a buzz these days. No conference is complete without a mention of 3D ICs, and there are reasons behind that. 3D ICs using through-silicon vias (TSVs) help you meet challenging performance and power targets to serve the growing demands of the networking, graphics,...
    Posted to Digital Implementation (Weblog) by samtabansal on Tue, Oct 12 2010
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