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Digital Implementation,TSV

  • 3D-IC TSV Realization: The Race Has Begun!

    3D IC discussions are creating quite a buzz these days. No conference is complete without a mention of 3D ICs, and there are reasons behind that. 3D ICs using through-silicon vias (TSVs) help you meet challenging performance and power targets to serve the growing demands of the networking, graphics,...
    Posted to Digital Implementation (Weblog) by samtabansal on Tue, Oct 12 2010
  • DAC 2010 – A “Coming Out” Party For 3D-IC Design

    Overall, the 2010 Anaheim DAC was livelier than the years before. Customer and vendor faces were not long and serious, but more purposeful and forward-looking. The recent M&A activity also brought in some rays of sunshine. The EDA360 vision for the entire industry resonated with a wide gamut of system...
    Posted to Digital Implementation (Weblog) by RahulD on Mon, Jun 28 2010
  • EDP Symposium Uncovers an Inconvenient Truth with a Shot of 3D

    Every April the leading edge of the leading edge of semiconductor industry meet at the Electronic Design Process (EDP) Symposium to address design problems that make design more difficult than it should be. This was my first visit and chance to rub shoulders with the industry's gurus and to discuss...
    Posted to Digital Implementation (Weblog) by RahulD on Fri, Apr 16 2010
  • My DATE With 3DIC Technology

    This year DATE (Design, Automation and Test in Europe) was in snowy cold Dresden, Germany, March 8th-March 12 th and offered several 3DIC topics during the conference. I heard someone say "How did 3D with TSVs become hot from cold just so quickly?" In fact it did. Last year when I was following...
    Posted to Digital Implementation (Weblog) by samtabansal on Mon, Mar 29 2010
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