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DAC,Si2,Silicon Integration Initiative

  • Si2 DAC Panel: What Standards are Needed for 3D-ICs?

    3D-ICs with through-silicon vias (TSVs) are not yet in volume production, but work has already begun on design standards - and more work is needed soon. An excellent update on work in progress, and a discussion of what's needed, was provided at a Silicon Integration Initiative (Si2) panel discussion...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jun 28 2012
  • DAC 2012: EDA Industry Celebrates 10 Years of OpenAccess

    The OpenAccess standard, which includes a common data model, API and reference database, has been one of the most successful and impactful standards in EDA history. Those who imagined, created, and continue to maintain and improve OpenAccess got some long overdue recognition June 4 at a Silicon Integration...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Jun 4 2012
  • Low Power Design -- Alive and Well at DAC

    Low power design was undoubtedly one of the themes of DAC this year -- especially at the Cadence booth. We drew lively interest on the DAC floor with our low power demo station, which was continuously busy especially on the free Monday. We were showing a new demo explaining how advanced low power techniques...
    Posted to Low Power (Weblog) by Pete Hardee on Tue, Jun 14 2011
  • New Proof Points for CPF-enabled Cadence Low Power Solution

    As the clock for the 48 th Design Automation Conference (DAC) ticks away, we at Cadence are scrambling to put the final touch-up on all our DAC activities. Even though my time is limited, I still would like to highlight the significance of two recent and seemingly unrelated events. First is a post at...
    Posted to Low Power (Weblog) by QiWang on Fri, Jun 3 2011
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