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DAC,DFM,Cadence

  • Taming the Challenges of IC Design

    AUSTIN, Texas--You want the bad news first or the good news about IC design challenges? Let's start with the bad news: As IC design moves into 20nm and 16nm nodes, the challenges facing not only designers but EDA vendors are extraordinary if the industry is to maintain momentum and design productivity...
    Posted to The Fuller View (Weblog) by Brian Fuller on Wed, Jul 24 2013
  • DAC 2012 Panelists Tackle Tough Questions About 2.5D-ICs and 3D-ICs

    In a sometimes contentious panel session at the Design Automation Conference (DAC 2012) June 7, experts discussed and debated key technology and business questions around 2.5D-ICs and 3D-ICs. One overall takeaway is that 2.5D technology is very close to volume production, but true 3D stacking raises...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jun 14 2012
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