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DAC 2013 -- Kaufman Winner Hu: FinFETs Will Serve Analog Design Very Well
AUSTIN, Texas--The father of the FinFET, who spent a career "attacking the barriers to Moore's Law," says the technology is going to surprise people when it comes to its utility for analog designs. Chenming Hu, TSMC Chair Professor at U.C. Berkeley, in accepting the 2013 EDAC Phil Kaufman...
Posted to
The Fuller View
(Weblog)
by
Brian Fuller
on Sun, Jun 2 2013
DAC 2013: Panel to Reveal FinFET Deployment Challenges
FinFET transistors represent one of the most exciting new technology developments in recent years, and no wonder - these 3D devices promise huge power and performance advantages at 16nm and below. But the deployment of advanced node designs with FinFETs raises a number of challenges. At the Design Automation...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Tue, May 28 2013
IP Talks! Video – ARM’s John Heinlein Cites SoC Success Requirements
John Heinlein, vice president of marketing for the Physical IP division at ARM, believes that an advanced system-on-chip (SoC) design shouldn't be a "leap of faith." In a keynote speech at the IP Talks! sessions at the ChipEstimate.com booth at the Design Automation Conference (DAC 2012...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Tue, Jul 10 2012
DAC 2012 Panelists Tackle Tough Questions About 2.5D-ICs and 3D-ICs
In a sometimes contentious panel session at the Design Automation Conference (DAC 2012) June 7, experts discussed and debated key technology and business questions around 2.5D-ICs and 3D-ICs. One overall takeaway is that 2.5D technology is very close to volume production, but true 3D stacking raises...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Jun 14 2012
TSMC-Cadence Collaboration Helps Clarify 3D-IC Ecosystem
Perhaps the most challenging question about 3D-IC design is what gets done when, by which kind of provider. With its recently introduced chip-on-wafer-on-substrate ( CoWoS ) process, TSMC has taken a step towards clarifying what the 3D-IC ecosystem might look like. And Cadence helped refine the methodology...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, Jun 4 2012
Cadence EDA360 Theater – Customers, Partners Speak Out at DAC 2012
Sometimes it's best to let other people do the talking. That's the approach Cadence has taken this year at the Design Automation Conference ( DAC 2012 ) at the EDA360 Theater at the Cadence booth (#1930). This theater will feature three days of presentations by customers and partners in an informal...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Tue, May 29 2012
System Development – What To See At DAC 2010
The EDA360 vision paper specifies key System Realization challenges. Embedded software development and verification are rapidly becoming the key increasing cost factors for the electronics industry. Integration and re-use are becoming critical for the success of any electronic company. In this blog,...
Posted to
System Design and Verification
(Weblog)
by
Ran Avinun
on Mon, Jun 7 2010
Page 1 of 1 (7 items)