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CoWoS,Encounter

  • TSMC 3D-IC Reference Flow Supports 3D Die Stacking

    An important milestone for any new semiconductor technology is the availability of a foundry EDA reference flow. Such a milestone occurred last week (Sept. 18, 2013) as Cadence and TSMC delivered the latest Cadence 3D-IC reference flow for true 3D die stacking (right). While there has been considerable...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Sep 24 2013
  • Place and route on SOC encounter

    Hello, I am a newbie at place and route operation. Can anyone please tell me how do you make sure that all the blockes i your design are arranged in a certain way while doing place and route . I mean I have like around 300 odd blockes to be eranged and I want them to be ordered row wise and column wise...
    Posted to Digital Implementation (Forum) by amythpai on Sun, Mar 17 2013
  • Via Placement issue.

    Hi every one, I'm Lakshmi Prashanth, and i'm new to this encounter tool, I've got a problem., initially when i was moving the PG net over the Macros, tool was automatically placing the via's, But suddenly yesterday, some via's are deleted automatically, I don't know how, and If...
    Posted to Digital Implementation (Forum) by Leader on Tue, Feb 12 2013
  • TSMC Forum: An Update on 20nm, 3D-IC, and 16nm FinFETs

    TSMC, the world's largest semiconductor foundry, is thinking big when it comes to next-generation process technology. At the TSMC Open Innovation Platform (OIP) Ecosystem Forum Oct. 16, TSMC described reference flows for 20nm and for multi-die integration, and revealed that ARM and TSMC are working...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 17 2012
  • TSMC-Cadence Collaboration Helps Clarify 3D-IC Ecosystem

    Perhaps the most challenging question about 3D-IC design is what gets done when, by which kind of provider. With its recently introduced chip-on-wafer-on-substrate ( CoWoS ) process, TSMC has taken a step towards clarifying what the 3D-IC ecosystem might look like. And Cadence helped refine the methodology...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Jun 4 2012
  • Problems Importing OA Design from Virtuoso into Encounter

    Hello, While trying to perform place and route using Encounter I'm "encountering" errors importing my design from Virtuoso. When I try to import the design, I get the following: Reading tech data from OA Library 'NCL' ... FE units: 0.001 microns/dbu, OA units: 0.001 microns/dbu...
    Posted to Digital Implementation (Forum) by TruLogic on Mon, Jan 10 2011
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