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Cadence

Q&A: 7 Years After Verisity – How Specman and e Language Changed IC Verification

Seven years ago this month (April 2005) Cadence acquired Verisity, the pioneering verification company that developed the e language and the Specman environment. The acquisition resulted in a paradigm shift in IC verification, setting the stage for reusable verification methodologies, constrained-random...

Posted to Industry Insights (Weblog) by rgoering on Tue, Apr 24 2012
IPC-2581 Update: Forward Progress on a PCB Data Transfer Standard

Six months ago, I wrote about a lively panel discussion at PCB West about printed circuit board data transfer standards. Most panelists - and many audience members - were supportive of IPC-2581, an "intelligent" data format that can potentially replace the various formats that designers use...

Posted to Industry Insights (Weblog) by rgoering on Mon, Apr 23 2012
Free Webinars Preview 20nm Challenges, Solutions

If you're designing or planning to design at 20nm - or you're just curious about this emerging and much-discussed process node - three free webinars May 1, 2 and 3 will provide a wealth of valuable information. In these webinars, Cadence experts will team up with industry leaders to present 20nm...

Posted to Industry Insights (Weblog) by rgoering on Thu, Apr 12 2012
Panelists: What Needs to Happen for 3D-IC TSV Success

It's time to get to work if we want to bring 3D-ICs with through-silicon vias (TSVs) into the semiconductor design mainstream. What ecosystem support is needed in the short term, medium term, and long term to make this new technology successful? That's the question that was put to a panel of...

Posted to Industry Insights (Weblog) by rgoering on Wed, Apr 11 2012
EDA Symposium: How Wide I/O is Driving 3D-ICs with TSVs

Any new technology needs a driving force or "killer app," and 3D-ICs with through-silicon vias (TSVs) are no exception. By allowing a high-bandwidth, low-power connection between CPU and DRAM, the new JEDEC wide I/O mobile DRAM standard will be that driving force, according to Marc Greenberg...

Posted to Industry Insights (Weblog) by rgoering on Tue, Apr 10 2012
spectreVerilog

Hello, I have being using spectreverilog tool to run some mixed signal sims. When I try to run pvt sims using ocean environment,the sims run fine but it looks for a license pair afresh as it is about to start the second PVT sim. It does not use the same set of spectre and verilog license it had acquired...

Posted to Custom IC Design (Forum) by uzzy on Tue, Apr 3 2012
High frequency quadrature VCO design with good phase noise

Hello everyone I am a newbie engineer starting my career in RF IC design and working on designing a high frequency VCO (38 GHz) with good phase noise characteristics. I am using Cadence IC6.1.5-64b.500 version and spectre simulator for the schemtic design and simulations. I have to do everything from...

Posted to Custom IC Design (Forum) by rohan kr on Thu, Mar 29 2012
CDNLive! Keynote – New Horizons for ARM Based SoCs

30 billion ARM-based chips have shipped over the last 20 years, but ARM isn't stopping there. ARM is looking beyond cell phones and mobile devices and pursuing new opportunities in the server, home entertainment, and automotive marketplaces, according to Tom Lantzsch (right), executive vice president...

Posted to Industry Insights (Weblog) by rgoering on Thu, Mar 15 2012
DVCon Panel Debate – “Build or Buy” Emulation and Prototyping?

Emulation and FPGA-based prototyping are becoming increasingly necessary for complex systems-on-chip, but where are these hardware-assisted tools going to come from? Should you invest the resources to build and maintain your own, or purchase a commercially available solution? In either case, what do...

Posted to Industry Insights (Weblog) by rgoering on Wed, Mar 7 2012
EDA CEOs Speak Out: 3D-ICs, IP Integration, Low Power, and More

What's driving the EDA industry today and where is it headed in the near future? Some high-level answers to these questions came from the EDA Consortium (EDAC) annual CEO Forecast panel Feb. 29, 2012. EDA industry leaders shared their views about 3D-ICs, SoC integration, power management, industry...

Posted to Industry Insights (Weblog) by rgoering on Mon, Mar 5 2012

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Cadence

Q&A: 7 Years After Verisity – How Specman and e Language Changed IC Verification

IPC-2581 Update: Forward Progress on a PCB Data Transfer Standard

Free Webinars Preview 20nm Challenges, Solutions

Panelists: What Needs to Happen for 3D-IC TSV Success

EDA Symposium: How Wide I/O is Driving 3D-ICs with TSVs

spectreVerilog

High frequency quadrature VCO design with good phase noise

CDNLive! Keynote – New Horizons for ARM Based SoCs

DVCon Panel Debate – “Build or Buy” Emulation and Prototyping?

EDA CEOs Speak Out: 3D-ICs, IP Integration, Low Power, and More