Log In
|
Register
|
Resource Library
|
Worldwide
Asia-Pacific
|
China
|
EMEA
|
India
|
Israel
|
Japan
|
Korea
|
Taiwan
|
Global Office Locator
Solutions
Products
Services
Support & Training
Alliances
Community
About Cadence
Solutions:
Design IP
Mixed-Signal
Low-Power
Advanced Node
3D-IC
Enterprise Verification
Hosted Design
System Development Suite
Solutions Home
Products for:
System Design and Verification
Functional Verification
Logic Design
Digital Implementation
Custom IC Design
RF Design
PCB Design
IC Packaging and SiP Design
Silicon Signoff and Verification
More Products
OrCAD Products
Sigrity Technologies
Design IP
Verification IP
IP Catalog
Products A-Z
Products Home
Capabilities and Practices
Methodology Services
Design Services
DFM Services
Educational Services
Programs
SOI Design Hub
Services Home
Support
Support Offerings
Support Process
Cadence Online Support
Software Downloads
Computing Platform Support
University Software Program
Training
Training Options
Training Course Catalogs
Support & Training Home
Programs and Initiatives
System Realization Alliance
Foundry Program
ChipEstimate.com - Chip Planning Portal
Connections Program
Verification Alliance Program
Channel Partner (VARs) Program
Power Forward Initiative
Standards and Languages
PCB Service Bureaus
Industry Memberships
Alliances Home
Communities
Industry Insights Blog
Low Power Blog
Mixed-Signal Design Blog
System Design and Verification
Cadence IP Blog
Functional Verification
Logic Design
Digital Implementation
Custom IC Design
RF Design
PCB Design
IC Packaging and SiP Design
Silicon Signoff and Verification
Quicklinks
All Blogs
All Forums
Community Search
CDNLive User Conferences
Community Home
EDA Vision
Visit the EDA360 microsite
News and Events:
Newsroom
Events and Webinars
Resources:
Customer Success
Newsletters
Publications
Multimedia Center
Logos
Company Info:
Investor Relations
Executive Team
Careers
Contact Us
About Cadence Home
Home
>
Community
>
Tags
> Cadence
Login with a Cadence account.
Not a member yet?
Create a permanent login account to make interactions with Cadence more conveniennt.
Register
|
Membership benefits
Get email delivery of the Cadence blog (individual posts).
Industry Insights
Low Power
Mixed-Signal Design
System Design
and Verification
Cadence IP Blog
Functional Verification
Logic Design
Digital Implementation
Custom IC Design
RF Design
PCB Design
IC Packaging and SiP Design
Silicon Signoff and Verification
All Blog Categories
Popular Tags
Allegro
Analog
ARM
cadence
DAC
Digital Implementation
e
EDA360
encounter
ESL
functional verification
Incisive
industry insights
Low power
Mixed-Signal
OVM
PCB
PCB design
Specman
System Design and Verification
SystemC
TLM
UVM
verification
Virtuoso
Browse All Tags
Email
*
Required Fields
Recipients email
*
(separate multiple addresses with commas)
Your name
*
Your email
*
Message
*
Send yourself a copy
Share
Twitter
Facebook
LinkedIn
Google+
Subscribe
RSS
Cadence RSS Feeds
Cadence Press Releases
System Design and Verification Blog
Functional Verification Blog
Digital Implementation Blog
Custom IC Design Blog
RF Design Blog
PCB Design Blog
IC Packaging and SiP Design Blog
Manufacturability Signoff Blog
All Blogs
System Design and Verification Forum
Functional Verification Forum
Digital Implementation Forum
Custom IC Design Forum
Custom IC SKILL Forum
Logic Design Forum
RF Design Forum
PCB Design Forum
PCB SKILL Forum
IC Packaging and SiP Design Forum
Manufacturability Signoff Forum
Intro copy of the newsletter section here, some intro copy of the newsletter. Instruction of how to subscribe to this newsletter.
Contact Us
Cadence Contacts
Community Relations
Customer Support
Employment
Investor Relations
Media Relations
Training
Global Office Locator
Find Offices worldwide
»
Sales Inquiry
Request for Product information
»
Cadence Channel Partners
»
Corporate Headquarters
Cadence Design Systems, Inc.
2655 Seely Avenue
San Jose, CA 95134
Phone: 408.943.1234
*
Required Fields
First Name
*
Last Name
*
Email
*
Company / Institution
*
Comments:
*
Send Yourself A Copy
Cadence
14nm
16.6
20 nm
20nm
28nm
3D
3D IC
3DIC
3D-IC
Acceleration
Accellera
ADE
Allegro
AMS
Analog
analog/mixed-signal
ARM
ARM Techcon
broadcom
CDNlive
CDNLive!
collaboration
Cortex-A15
Cortex-M0
CPF
custom/analog
DAC
DAC 2012
debug
Design Automation Conference
design rules
DFT
Digital
Digital Implementation
Double Patterning
DRAM
DVCon
EDA
EDA360
EDI
embedded software
emulation
encounter
ESL
ETS
extraction
FinFET
formal verification
functional verification
GlobalFoundries
IBM
Incisive
Industry Insights
IP
layout
lithography
Logic Design
Low power
memory
Mentor
mixed signal
Mixed-Signal
OpenAccess
Palladium
Palladium XP
Panel
PCB
Power
QRC
routing
RTL Compiler
Samsung
Schirrmeister
Si2
Simulation
SoC
Spectre
SPICE
Synopsys
synthesis
System Design and Verification
System Development Suite
SystemC
system-level design
SystemVerilog
TLM
TSMC
TSV
UVM
verification
Verification Computing Platform
Verification IP
VIP
virtual platforms
Virtual System Platform
Virtuoso
webinar
wide i/o
Xilinx
Zynq-7000
DAC 2012 Panelists: How to Succeed at 28nm, 20nm and 14nm
What will it take to achieve silicon success at 28nm and below? That was the question put to a panel of experts at a Cadence-sponsored breakfast at the Design Automation Conference ( DAC 2012 ) June 6, where speakers from IBM, Cadence, ARM, Samsung, and GLOBALFOUNDRIES shed new light on business and...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Tue, Jun 12 2012
DAC 2012: How Unified Coverage Interoperability Standard (UCIS) Will Ease IC Verification
Some significant news was announced at the Design Automation Conference June 4 - the official debut of the Unified Coverage Interoperability Standard ( UCIS 1.0 ) by the Accellera standards organization. Accellera hosted a June 6 lunch event at which Richard Ho (right), co-chair of the UCIS Committee...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, Jun 11 2012
DAC 2012: Connecting Emulation to the Real World of Wireless Interfaces
This is certainly the most connected DAC I have been to so far. Tweets and connections everywhere, blogging is happening left and right. A lot of the attendees hold their wireless devices in their hands. It is rewarding that we are part of enabling all that. Living proof of that came today from our System...
Posted to
System Design and Verification
(Weblog)
by
fschirrmeister
on Tue, Jun 5 2012
DAC 2012: EDA Industry Celebrates 10 Years of OpenAccess
The OpenAccess standard, which includes a common data model, API and reference database, has been one of the most successful and impactful standards in EDA history. Those who imagined, created, and continue to maintain and improve OpenAccess got some long overdue recognition June 4 at a Silicon Integration...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, Jun 4 2012
TSMC-Cadence Collaboration Helps Clarify 3D-IC Ecosystem
Perhaps the most challenging question about 3D-IC design is what gets done when, by which kind of provider. With its recently introduced chip-on-wafer-on-substrate ( CoWoS ) process, TSMC has taken a step towards clarifying what the 3D-IC ecosystem might look like. And Cadence helped refine the methodology...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, Jun 4 2012
DAC 2012 Gary Smith EDA Kickoff: EDA and ESL Growth and Four Different Software Virtual Prototypes
DAC 2012 kicked off yesterday with the annual DAC Reception followed by Gary Smith's keynote detailing challenges in EDA. For system-level design there was some really good news, but also some interesting detailed refinement on how much effort virtual prototyping for enablement of software development...
Posted to
System Design and Verification
(Weblog)
by
fschirrmeister
on Mon, Jun 4 2012
DAC 2012: Handling a Double Paradigm Shift for Embedded Software Development
Change is hard. And we in product marketing for development tools are trying to cause change and find out if and how users are adopting new methodologies and tools. A little over a year ago, in the spirit of fellow Blogger Steve Leibson's law, that "it takes 10 years for any disruptive technology...
Posted to
System Design and Verification
(Weblog)
by
fschirrmeister
on Mon, Jun 4 2012
Cadence EDA360 Theater – Customers, Partners Speak Out at DAC 2012
Sometimes it's best to let other people do the talking. That's the approach Cadence has taken this year at the Design Automation Conference ( DAC 2012 ) at the EDA360 Theater at the Cadence booth (#1930). This theater will feature three days of presentations by customers and partners in an informal...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Tue, May 29 2012
How to add a company logo or a marking seregraphy with "Allegro PCB Design"
Hi, how to add a company logo, a picture, or a marking seregraphy in PCB board with "Allegro PCB Design", see exemple in attached image: Best regards, Haithem.
Posted to
PCB Design
(Forum)
by
HaithemEmbedde
on Mon, May 28 2012
Re: cadence encounter flow
thanks for the response sir.but i am unable to open the link even after entering the host id of the system. can u please tell me about the post layout simulation of the design in cadence tool?I did not get the steps to do that.I have done with DRC and LVS of the circuit.
Posted to
Digital Implementation
(Forum)
by
shakun
on Sun, May 27 2012
Page 13 of 22 (216 items)
« First
...
< Previous
11
12
13
14
15
Next >
...
Last »