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  • Panelists: What Needs to Happen for 3D-IC TSV Success

    It's time to get to work if we want to bring 3D-ICs with through-silicon vias (TSVs) into the semiconductor design mainstream. What ecosystem support is needed in the short term, medium term, and long term to make this new technology successful? That's the question that was put to a panel of...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Apr 11 2012
  • 2011 EDA Standards Update and 2012 Forecast

    As system complexity grows and semiconductor process nodes shrink, EDA industry standards are more important than ever. With today's time-to-market pressures, the last thing you'd want to do is waste time due to incompatible formats, tools or methodologies. Fortunately, 2011 was a productive...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Dec 21 2011
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