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Allegro,SKILL,Industry Insights

  • TSMC 3D-IC Reference Flow Supports 3D Die Stacking

    An important milestone for any new semiconductor technology is the availability of a foundry EDA reference flow. Such a milestone occurred last week (Sept. 18, 2013) as Cadence and TSMC delivered the latest Cadence 3D-IC reference flow for true 3D die stacking (right). While there has been considerable...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Sep 24 2013
  • CDNLive! Paper –Why Doesn’t My Board Work?

    Why would a printed circuit board design go through a CAD system without a hitch, and then produce problems in fabrication or assembly - or worse, fail in the field? A paper at the recent CDNLive! Silicon Valley 2012 (Cadence user group conference) illustrated a number of ways this can happen, and showed...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Apr 3 2012
  • Top Ten Cadence Community Blog Posts of 2011

    Over 430 Cadence Community blog posts appeared in 2011, in categories including Industry Insights, Functional Verification, PCB Design, System Design & Verification, Custom IC, Digital Implementation, RF, Mixed Signal, and Low Power. By looking at the most widely-read posts, we can get a picture...
    Posted to Industry Insights (Weblog) by rgoering on Sun, Jan 1 2012
  • Ten Things You (Probably) Didn’t Know About SKILL

    The Cadence SKILL language has received some press lately as part of an ongoing debate over process design kit (PDK) standards. This post isn't about that. Rather, it's about the story behind SKILL, a venerable language that's far more than just a format for describing PCells in custom IC...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Aug 9 2010
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