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Allegro,Industry Insights
2.5D
2.5D IC
2581
3D
3D IC
3D IC ecosystem
3D-IC
Adiva
AiDT
Allegro 16.5
Allegro 16.6
Allegro Design Workbench
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Analog
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ASIC
Auto-interactive delay tune
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Co-Design
custom
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e language
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electronic design
EM
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embedded components
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EMC
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Encounter
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Fang
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Functional Verification
Gerber
GPUs
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high speed
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high-speed signals
IC packaging
IPC-2581
MCAD
mechanical CAD
Mentor
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package
packaging
PCB
PCB Design
PCB West
PCIe
PDN
PI
PLM
power integrity
PowerSI
product creation
ProStep
SI
signal integrity
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silicon interposer
SKILL
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wide i/o
How PCB and IC Package Design Can Enable “Product Creation”
My last blog post introduced the notion of "product creation," which looks beyond the chip and the board - the traditional focal points of EDA - to also consider software, mechanical enclosures, and everything else required to produce an actual product by semiconductor vendors and OEMs. That...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Tue, Feb 5 2013
“Product Creation” Gives EDA a Broader Focus
One term you are likely to hear from Cadence in 2013 is "product creation." A key message in the Cadence Systems and Software Group (SSG), product creation looks beyond chip or board design and considers the entire end product, including software applications, mechanical enclosures, and the...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, Feb 4 2013
Q&A: Jiayuan Fang Discusses Sigrity, Cadence Merger, Signal and Power Integrity, and 3D-ICs
In July 2012 Cadence announced its acquisition of Sigrity , a leading provider of signal integrity (SI) and power integrity (PI) analysis tools for chip, package and board. Jiayuan Fang, Sigrity founder and CEO, joined Cadence as vice-president of R&D for high-speed design products in the Silicon...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, Dec 12 2012
Allegro 16.6: Easing PCB Design for Multi-Gigabit/Second Signals
Got a few picoseconds to spare? If you're a PCB designer working with a multi-Gbit/second serial link interface such as PCI Express 3.0 or a DDR memory interface, maybe not. Two new features in the Cadence Allegro 16.6 PCB design solution - announced today (Sept. 25, 2012) at PCB West - aim to help...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Tue, Sep 25 2012
Why Cadence Bought Sigrity – And How it May Change PCB Analysis
On July 2 Cadence announced its acquisition of Sigrity , a provider of signal integrity and power network analysis tools for PCB and IC package design. Cadence already has some technology in these areas, and many Allegro and OrCAD customers use Sigrity tools today. So why buy Sigrity, and why make this...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Jul 12 2012
TSMC-Cadence Collaboration Helps Clarify 3D-IC Ecosystem
Perhaps the most challenging question about 3D-IC design is what gets done when, by which kind of provider. With its recently introduced chip-on-wafer-on-substrate ( CoWoS ) process, TSMC has taken a step towards clarifying what the 3D-IC ecosystem might look like. And Cadence helped refine the methodology...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, Jun 4 2012
CDNLive! Paper –Why Doesn’t My Board Work?
Why would a printed circuit board design go through a CAD system without a hitch, and then produce problems in fabrication or assembly - or worse, fail in the field? A paper at the recent CDNLive! Silicon Valley 2012 (Cadence user group conference) illustrated a number of ways this can happen, and showed...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Tue, Apr 3 2012
Free Techtorials for Allegro and OrCAD users – PCB Planning, Signal Integrity
If you're an IC packaging or PCB designer, there's a free one-day event just for you at the Cadence San Jose, California headquarters March 15, 2012. Coming one day after CDNLive! Silicon Valley , the event will feature product/technology roadmaps, an interactive roundtable discussion, and half...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Feb 16 2012
Top Ten Cadence Community Blog Posts of 2011
Over 430 Cadence Community blog posts appeared in 2011, in categories including Industry Insights, Functional Verification, PCB Design, System Design & Verification, Custom IC, Digital Implementation, RF, Mixed Signal, and Low Power. By looking at the most widely-read posts, we can get a picture...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Sun, Jan 1 2012
IPC-2581 Panel: A Spirited Discussion on PCB Data Transfer Formats
A lively panel discussion Sept. 29 revealed that PCB designers have some strong opinions about the data formats that convey design intent to manufacturing. Several audience members expressed support for the Gerber data format that has been around for over 30 years. But other audience members and panelists...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Sun, Oct 2 2011
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