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Allegro 16.6,Grzenia,IC Packaging
16.6
advanced package designer
Allegro
Allegro GUI
Allegro Package Designer
Allegro RF SiP
APD
blind vias
bond wires
Cadence
design
die abstract
die abstracts
Digital SiP design
High Speed
IC Packaging and SiP Design
IC/package co-design
inset vias
layer stacks
packaging
PCB
PCB design
RF SiP
shape shorting
shorting vias
SiP
SiP layout
via
vias
Virtuoso SiP
wire bond
wirebond
What's Good About Allegro Package Designer (APD) Bond Wire "Text In?" You’ll Need the 16.6 Release to See!
Cadence IC Packaging tools today provide a spreadsheet-based import mechanism for die and BGA (standard) components, as well as for importing of netlist updates. In certain design scenarios, particularly for leadframe package designs, it is also desirable to be able to import a similarly formatted file...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Tue, Mar 19 2013
What's Good About RF SiP and Data Management? Look to 16.6 and See!
The 16.6 Allegro RF SiP product has 3 major enhancements to improve your productivity. Read on for more details … Data Management of Virtuoso SiP Views In release 16.6, Virtuoso SiP Architect is enhanced to support data management of SiP views through the Virtuoso Library Manager. To enable this...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Tue, Dec 4 2012
What's Good About APD’s Shape Shorting? You’ll Need the 16.6 Release to See!
In some designsflows, you need to connect two plane shapes on the same net, but on different layers, together with vias in order to improve connectivity. These “shorting” vias are placed in a regular pattern across the overlapping areas of the shape, in such a way as not to interfere with...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Tue, Nov 13 2012
Page 1 of 1 (3 items)