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ARM TechCon Paper: Early Architectural Planning With a Digital Implementation Flow
You might think that an IC digital implementation toolset, such as the Cadence Encounter Digital Implementation System, is only useful after RTL is developed and synthesized. But that's not necessarily the case. At the recent ARM TechCon conference, Cadence and Cisco Systems presented a flow that...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, Nov 30 2011
ARM TechCon Paper: Using a Virtual Platform for Multi-Core Software Development
You may have heard that "virtual platforms" enable software development and debugging before system hardware is available. But how do you build them, how do you solve common problems, and how do you debug software and hardware for multi-core systems? These questions and more were answered in...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, Nov 21 2011
ARM TechCon Paper: Why DRAM Latency is Getting Worse
There's a general view that everything gets faster and better as technology advances, but when it comes to external memory latency, that's not the case. In a recent ARM TechCon paper Marc Greenberg, director of product marketing at Cadence, showed why DRAM latency is increasing and discussed...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Nov 17 2011
ARM TechCon Paper: New Methodology Eases Challenges of 32/28nm Designs
The 32nm and 28nm process nodes, the most advanced nodes currently in production, pose formidable challenges in complexity, power management, variability, and manufacturability. A recent ARM TechCon paper authored by Cadence and Samsung described a methodology that can resolve those challenges. And it's...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, Nov 9 2011
ARM TechCon Highlights Roundup – Blogs, Videos, and More
The recent ARM TechCon conference was a great success, and so much happened in 3 days there that it's very difficult to keep track of it all. Here's a "coverage roundup" that includes some pointers to blogs, articles, and videos that might help fill in anything you missed - or shed...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Nov 3 2011
ARM TechCon Paper: “Tips and Tricks” for Cortex-A15 Designs
The Cortex-A15 MPCore, ARM's most advanced processor, requires an optimized tool flow and design methodology to meet power, performance and area goals. A paper at the recent ARM TechCon conference showed how Texas Instruments, in collaboration with Cadence and ARM, successfully pioneered one of the...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, Nov 2 2011
ARM TechCon: Q&A With Lip-Bu Tan, Cadence CEO
What kind of collaboration does the semiconductor industry need now? How can we get more venture capital money into semiconductors? Is there a future for EDA in the cloud? These are a few of the questions asked by Simon Segars, executive vice president and general manager of ARM, of Lip-Bu Tan, president...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Oct 27 2011
Virtual Platform for Xilinx Zynq – Why “Extensible” Matters
You would expect a unique semiconductor product to have a unique software development environment. That is the case with the Xilinx Zynq-7000 family, an Extensible Processing Platform (EPP) that includes a dual-core ARM Cortex-A9 processor and a 28nm FPGA fabric. Today (Oct. 26, 2011) at ARM TechCon...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, Oct 26 2011
ARM TechCon Address: High Stakes at Low Process Nodes
The complexity of advanced-node IC designs is skyrocketing, and the demands on EDA tool development seem overwhelming - but innovation and deep collaboration will break through the challenges, according to Chi-Ping Hsu, senior vice president for R&D at the Silicon Realization group at Cadence. In...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Tue, Oct 25 2011
Cadence-ARM Collaboration Brings Optimized Tools to SoC Designers
Cadence and ARM have been working closely together for several years, and that relationship reached a new milestone Oct. 18 with the joint announcement of the first 20nm tapeout using the Cortex-A15 MPCore processor. The announcement also brought news of a multi-year technology collaboration that will...
Posted to
Industry Insights
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by
rgoering
on Tue, Oct 18 2011
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