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APD

What's Good About APD’s Wirebond Color Visibility? You’ll Need the 16.5 Release to See!

Prior to the 16.0 release, color and visibility (CV) settings of bond wires in Allegro Package Designer were based on the traditional layer model whereby wires were represented as 2-dimensional cline objects that could be colored and made visible or invisible depending on the layer they were on. In 16...

Posted to PCB Design (Weblog) by Jerry GenPart on Tue, May 22 2012
Customizing Alias

Hi I am currently using version 16.5 and cannot seem to find the menu to customize the alias (I recall seeing this function) Could someone put me out in the general direction? Thanks in advance!

Posted to IC Packaging and SiP Design (Forum) by yitch on Fri, May 18 2012
DIE/ BGA rotation, before and after generation

Hi, does anyone know how to rotate the die or the bga before and after rotation? Currently working on a stacked die package. Would prefer to know how to do it after generation, but for completeness if there is a method to do it before that would be great as well. Thanks!

Posted to IC Packaging and SiP Design (Forum) by yitch on Tue, May 15 2012
Deleting ball from BGA for APD 16.5

Hi, I previously used APD 15.XX and the balls from BGA could be deleted by going to the 'edit' -> 'BGA' however that option seems to have disappeared in 16.5 Can anyone please advise as to how I can go about deleting unwanted balls from the BGA? It's rather frustrating... Thanks...

Posted to IC Packaging and SiP Design (Forum) by yitch on Mon, May 14 2012
What's Good About APD’s Die Abstract Libraries? You’ll Need the 16.5 Release to See!

In System in Package (SiP) 16.3, the co-design die flow introduced the distributed co-design flow concept, where there is no direct interaction with I/O Planner. Die information flowing between Encounter and SiP Layout is done via a die abstract. In flows up through 16.3, you first need to load the LEF...

Posted to PCB Design (Weblog) by Jerry GenPart on Tue, Jan 24 2012
What's Good About APD’s Die Abstract Compare? You’ll Need the 16.5 Release to See!

In the distributed co-design environment in the SPB16.5 Allegro Package Designer release, a die abstract file is used to convey die information between IC and package layout tools. For ECO purposes, it is imperative to know the changes that are incorporated inside an abstract file before incorporating...

Posted to PCB Design (Weblog) by Jerry GenPart on Tue, Oct 18 2011
What's Good About Retaining Electrical Constraints? Look to SPB16.5 and See!

Currently, many of the SPB products support extended nets, better known as Xnets. Xnets are created automatically when a signal model is assigned to a component and that signal model defines that a connection is to be made between two pins of the component. This creates an Xnet that connects the nets...

Posted to PCB Design (Weblog) by Jerry GenPart on Mon, Aug 8 2011
What's Good About APD’s Assembly DRCs? You’ll Need the 16.5 Release to See!

Prior to the Allegro Package Designer (APD) 16.3 release, Design Rule Check (DRC) markers created by Assembly Rule Checks had to be external DRC markers since no constraint IDs were associated with the ADRC constraints. In the 16.3 release, Constraint IDs were created for each of the rules. It enabled...

Posted to PCB Design (Weblog) by Jerry GenPart on Tue, Jul 26 2011
What's Good About Cadence Online Support Product Pages? – Check Out This List!

I wrote about the new Cadence Online Support features in one of my blog posts last year. One of our Silicon Package Board (SPB) Customer Support AEs suggested that I include the Cadence Online Support Product Page URL whenever I write about a specific product’s feature. I will be doing that --...

Posted to PCB Design (Weblog) by Jerry GenPart on Wed, Mar 2 2011
What's Good About APD Wire Bonding? SPB16.3 has MANY New Enhancements!

As with every new release, a primary focus for the Allegro Package Designer (APD) PCB IC Packaging tools is the wire bonding capabilities. These are some of the most frequently used, complex, and crucial commands in the tool. As the majority of packages today are still based on wire bond technology,...

Posted to PCB Design (Weblog) by Jerry GenPart on Wed, Jan 12 2011

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APD

What's Good About APD’s Wirebond Color Visibility? You’ll Need the 16.5 Release to See!

Customizing Alias

DIE/ BGA rotation, before and after generation

Deleting ball from BGA for APD 16.5

What's Good About APD’s Die Abstract Libraries? You’ll Need the 16.5 Release to See!

What's Good About APD’s Die Abstract Compare? You’ll Need the 16.5 Release to See!

What's Good About Retaining Electrical Constraints? Look to SPB16.5 and See!

What's Good About APD’s Assembly DRCs? You’ll Need the 16.5 Release to See!

What's Good About Cadence Online Support Product Pages? – Check Out This List!

What's Good About APD Wire Bonding? SPB16.3 has MANY New Enhancements!