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3DIC,through-silicon vias,2.5D

  • EDA Symposium: Users Cite 3D-IC Design Tool Needs

    What's needed to bring 3D-ICs with through-silicon vias (TSVs) - or 2.5D ICs with silicon interposers - into the IC design mainstream and volume production? That question resonated through a day-long session on 3D-ICs at the Electronic Design Processes Symposium ( EDPS ) April 6, 2012 in Monterey...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Apr 9 2012
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