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3DIC,Reiter,TSVs

  • Two New Resources for 3D-IC Design

    Just in time for the Design Automation Conference (DAC), two new publications are providing fresh perspectives about 3D-IC design. First, the Global Semiconductor Alliance ( GSA ) has released a "3D-IC Design Tools and Services Tour Guide" for next week's DAC. Secondly, a new Cadence technical...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jun 2 2011
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