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  • Two New Resources for 3D-IC Design

    Just in time for the Design Automation Conference (DAC), two new publications are providing fresh perspectives about 3D-IC design. First, the Global Semiconductor Alliance ( GSA ) has released a "3D-IC Design Tools and Services Tour Guide" for next week's DAC. Secondly, a new Cadence technical...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jun 2 2011
  • IEEE Workshop: Panelists Identify Requirements for 3D IC Adoption

    3D ICs with through-silicon vias (TSVs) are in development by a few large companies, but they're a long ways from widespread adoption. What will it take to move this technology into the IC design mainstream? Panelists at the IEEE Electronic Design Processes ( EDP ) workshop April 8 came up with some...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Apr 14 2011
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