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  • EDA Symposium: How Wide I/O is Driving 3D-ICs with TSVs

    Any new technology needs a driving force or "killer app," and 3D-ICs with through-silicon vias (TSVs) are no exception. By allowing a high-bandwidth, low-power connection between CPU and DRAM, the new JEDEC wide I/O mobile DRAM standard will be that driving force, according to Marc Greenberg...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Apr 10 2012
  • EDA Symposium: Users Cite 3D-IC Design Tool Needs

    What's needed to bring 3D-ICs with through-silicon vias (TSVs) - or 2.5D ICs with silicon interposers - into the IC design mainstream and volume production? That question resonated through a day-long session on 3D-ICs at the Electronic Design Processes Symposium ( EDPS ) April 6, 2012 in Monterey...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Apr 9 2012
  • EDA Workshop: A Reality Check On 3D ICs

    3D ICs are an attractive technology, but what will it take to make them successful? Presenters at the recent Electronic Design Processes (EDP) workshop didn't have all the answers, but they had a lot of interesting insights into how EDA tools and flows will need to change to support stacked die with...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Apr 19 2010
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