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3D-IC,ARM,Double Patterning

  • Common Platform Forum Keynotes: 14nm FinFETs and Beyond

    How far can we continue to scale semiconductors? 14nm FinFET technology is the next major move, but that's far from the end of the story, according to keynote speakers at the Common Platform Technology Forum in Santa Clara, California Feb. 5, 2013. The keynotes, still available for on-line viewing...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Feb 6 2013
  • TSMC Forum: An Update on 20nm, 3D-IC, and 16nm FinFETs

    TSMC, the world's largest semiconductor foundry, is thinking big when it comes to next-generation process technology. At the TSMC Open Innovation Platform (OIP) Ecosystem Forum Oct. 16, TSMC described reference flows for 20nm and for multi-die integration, and revealed that ARM and TSMC are working...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 17 2012
  • DAC Panel: 20nm is Tough, But Not a Roadblock

    So far the move to lower semiconductor process nodes has continued unabated, but the upcoming 20nm node is causing a lot of concern. Lithography is so challenging that extra masks ( double patterning ) will be required. Will designs be technically and economically feasible? Panelists at the Design Automation...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Jun 6 2011
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