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3D ecosystem,Leibson,Smith,tungsten,3D: 2.5D,Sekar,microbumps
3D IC
3DIC
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Bansal
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Industry Insights
interposer
Marcoux
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Panel
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TSV
vias
Panelists: What Needs to Happen for 3D-IC TSV Success
It's time to get to work if we want to bring 3D-ICs with through-silicon vias (TSVs) into the semiconductor design mainstream. What ecosystem support is needed in the short term, medium term, and long term to make this new technology successful? That's the question that was put to a panel of...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, Apr 11 2012
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