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32nm

ARM TechCon Paper: New Methodology Eases Challenges of 32/28nm Designs

The 32nm and 28nm process nodes, the most advanced nodes currently in production, pose formidable challenges in complexity, power management, variability, and manufacturability. A recent ARM TechCon paper authored by Cadence and Samsung described a methodology that can resolve those challenges. And it's...

Posted to Industry Insights (Weblog) by rgoering on Wed, Nov 9 2011
ARM TechCon Address: High Stakes at Low Process Nodes

The complexity of advanced-node IC designs is skyrocketing, and the demands on EDA tool development seem overwhelming - but innovation and deep collaboration will break through the challenges, according to Chi-Ping Hsu, senior vice president for R&D at the Silicon Realization group at Cadence. In...

Posted to Industry Insights (Weblog) by rgoering on Tue, Oct 25 2011
Common Platform Forum: A Clearer Path to Advanced Process Nodes

Insights into what you can expect at 32/28nm and below came to the forefront at the Common Platform Technology Forum Jan. 18, a well-attended one-day event in Silicon Valley. One point that caught my attention is that IBM is turning to a "gate last" high-k metal gate (HKMG) technology at 20nm...

Posted to Industry Insights (Weblog) by rgoering on Tue, Jan 18 2011
Physicist: Quantum Uncertainty May Stall Moore’s Law

The Embedded Systems Conference could hardly have found a more interesting keynote speaker than Dr. Michio Kaku , a well-known author and theoretical physicist who recently wrote a book entitled " Physics of the Impossible ." As a frequent watcher of his programs on the Science Channel , I...

Posted to Industry Insights (Weblog) by rgoering on Thu, Apr 29 2010
Guest Blog: Characterizing Process Variability At 32 nm And Below

Process characterization becomes much more complex as feature sizes shrink. In this guest blog Jim Bordelon, president and CTO of Stratosphere Solutions , describes requirements and methodologies for modeling variability at 32 nm and below. Peering under the hood of a 32 nm process early in its lifecycle...

Posted to Industry Insights (Weblog) by rgoering on Wed, Nov 18 2009
Panelists: 32 nm HKMG Is Ready To Roll

The 32/28 nm Common Platform high-k metal gate (HKMG) technology is “ready and open for business,” according to the title of a breakfast panel at the ARM Techcon3 conference Oct. 22. Panelists from IBM , ARM and Cadence talked about the benefits of HKMG, the requirements it places on the...

Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 28 2009

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32nm

ARM TechCon Paper: New Methodology Eases Challenges of 32/28nm Designs

ARM TechCon Address: High Stakes at Low Process Nodes

Common Platform Forum: A Clearer Path to Advanced Process Nodes

Physicist: Quantum Uncertainty May Stall Moore’s Law

Guest Blog: Characterizing Process Variability At 32 nm And Below

Panelists: 32 nm HKMG Is Ready To Roll