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Si2: Jim Hogan Predicts “Custom 2.0” IC Design Retooling
A re we heading for a major retooling in custom IC design? EDA veteran Jim Hogan thinks so, and in a keynote speech at the Silicon Integration Initiative ( Si2 ) Conference Oct. 9, 2012, he argued that the consumer electronics marketplace will drive a new era he calls "Custom 2.0." The Si2...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Oct 11 2012
ARM and Cadence Improve Cortex-A Power and Performance with Optimized Flow
For several years, ARM has offered processor optimization utilities (called POPs) that help users of ARM Cortex-A series processors optimize power, performance and area for a given process. This week (Aug. 9) ARM and Cadence took things one step further by announcing a POP that includes scripts that...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Aug 9 2012
DAC 2012 Panelists: How to Succeed at 28nm, 20nm and 14nm
What will it take to achieve silicon success at 28nm and below? That was the question put to a panel of experts at a Cadence-sponsored breakfast at the Design Automation Conference ( DAC 2012 ) June 6, where speakers from IBM, Cadence, ARM, Samsung, and GLOBALFOUNDRIES shed new light on business and...
Posted to
Industry Insights
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rgoering
on Tue, Jun 12 2012
ARM TechCon Paper: New Methodology Eases Challenges of 32/28nm Designs
The 32nm and 28nm process nodes, the most advanced nodes currently in production, pose formidable challenges in complexity, power management, variability, and manufacturability. A recent ARM TechCon paper authored by Cadence and Samsung described a methodology that can resolve those challenges. And it's...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, Nov 9 2011
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