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28nm,DRC+

  • ARM TechCon Address: High Stakes at Low Process Nodes

    The complexity of advanced-node IC designs is skyrocketing, and the demands on EDA tool development seem overwhelming - but innovation and deep collaboration will break through the challenges, according to Chi-Ping Hsu, senior vice president for R&D at the Silicon Realization group at Cadence. In...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Oct 25 2011
  • “In Design” DFM Signoff – the Inside Story

    As noted in a recent customer announcement with Fujitsu, Cadence offers "in design" design for manufacturability (DFM) signoff for digital, mixed-signal and custom IC design. The basic idea is simple - engineers run signoff DFM checks during the physical design process, instead of waiting until...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 5 2011
  • Analog/Mixed-Signal at 28nm – An Inside Look

    A common belief is that "analog doesn't scale." But analog/mixed-signal design can indeed work at advanced process nodes. An inside look into how, and what the challenges are, comes from a recent partnership between GLOBALFOUNDRIES and Cadence that produced a 28nm analog/mixed-signal design...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Nov 8 2010
  • How DRC Plus Makes DFM Easy at 28nm

    Design for manufacturability (DFM) requirements have been a barrier for many design teams who are thinking about moving to lower process nodes. But can DFM actually get easier as process nodes shrink? That possibility is offered by DRC Plus (DRC+), a new technology developed by GLOBALFOUNDRIES in collaboration...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Oct 25 2010
  • GTC Conference: GLOBALFOUNDRIES Charts Unique Path to 28nm

    The first-ever Global Technology Conference (GTC), held by GLOBALFOUNDRIES Sept. 1 in Silicon Valley, made it clear that the company is aggressively going after the advanced-node foundry business and is moving ahead quickly on 28nm and below. GLOBALFOUNDRIES claims three distinctive capabilities in its...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Sep 7 2010
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