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20nm,signoff

  • Whitepaper: 20nm is More Than Just Double Patterning

    Probably the most discussed challenge of the 20nm process node is double patterning, which uses extra masks in order to get lithography equipment to print correctly. That is, indeed, a major change that has impacts throughout the design flow. But as a newly published Cadence whitepaper points out, double...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Jul 9 2012
  • 12 Hot EDA Topics – 78 DAC Demo Sessions

    Whatever your role in the chip or system design process, there is probably a Cadence demo geared to your interests at the Design Automation Conference ( DAC 2012 ) June 3-7 in San Francisco. Cadence has three demo suites at its booth (#1930) and is running one-hour demos from 10:00 am to 5:00 pm Monday...
    Posted to Industry Insights (Weblog) by rgoering on Thu, May 24 2012
  • “In Design” DFM Signoff – the Inside Story

    As noted in a recent customer announcement with Fujitsu, Cadence offers "in design" design for manufacturability (DFM) signoff for digital, mixed-signal and custom IC design. The basic idea is simple - engineers run signoff DFM checks during the physical design process, instead of waiting until...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 5 2011
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