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20nm,3D-IC,HKMG

  • Common Platform Forum Keynotes: 14nm FinFETs and Beyond

    How far can we continue to scale semiconductors? 14nm FinFET technology is the next major move, but that's far from the end of the story, according to keynote speakers at the Common Platform Technology Forum in Santa Clara, California Feb. 5, 2013. The keynotes, still available for on-line viewing...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Feb 6 2013
  • DAC 2012 Panelists: How to Succeed at 28nm, 20nm and 14nm

    What will it take to achieve silicon success at 28nm and below? That was the question put to a panel of experts at a Cadence-sponsored breakfast at the Design Automation Conference ( DAC 2012 ) June 6, where speakers from IBM, Cadence, ARM, Samsung, and GLOBALFOUNDRIES shed new light on business and...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Jun 12 2012
  • DAC Panel: 20nm is Tough, But Not a Roadblock

    So far the move to lower semiconductor process nodes has continued unabated, but the upcoming 20nm node is causing a lot of concern. Lithography is so challenging that extra masks ( double patterning ) will be required. Will designs be technically and economically feasible? Panelists at the Design Automation...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Jun 6 2011
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