Home > Community > Tags > 20nm/3D IC/3D-IC/ARM
 
Login with a Cadence account.
Not a member yet?
Create a permanent login account to make interactions with Cadence more conveniennt.

Register | Membership benefits
Get email delivery of the Cadence blog (individual posts).
 

Email

* Required Fields

Recipients email * (separate multiple addresses with commas)

Your name *

Your email *

Message *

Contact Us

* Required Fields
First Name *

Last Name *

Email *

Company / Institution *

Comments: *

20nm,3D IC,3D-IC,ARM

  • DAC 2012 Panelists: How to Succeed at 28nm, 20nm and 14nm

    What will it take to achieve silicon success at 28nm and below? That was the question put to a panel of experts at a Cadence-sponsored breakfast at the Design Automation Conference ( DAC 2012 ) June 6, where speakers from IBM, Cadence, ARM, Samsung, and GLOBALFOUNDRIES shed new light on business and...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Jun 12 2012
  • 12 Hot EDA Topics – 78 DAC Demo Sessions

    Whatever your role in the chip or system design process, there is probably a Cadence demo geared to your interests at the Design Automation Conference ( DAC 2012 ) June 3-7 in San Francisco. Cadence has three demo suites at its booth (#1930) and is running one-hour demos from 10:00 am to 5:00 pm Monday...
    Posted to Industry Insights (Weblog) by rgoering on Thu, May 24 2012
  • TSMC CDNLive! Keynote – “We Can Beat Moore’s Law”

    The world's largest foundry provider, TSMC, is confident it can keep up with the semiconductor scaling predicted by Moore's Law and can even outpace Moore's Law through 2.5D and 3D-ICs. It's all part of the "incredible high-tech future" predicted by Rick Cassidy, president of...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Mar 14 2012
  • DAC Panel: 20nm is Tough, But Not a Roadblock

    So far the move to lower semiconductor process nodes has continued unabated, but the upcoming 20nm node is causing a lot of concern. Lithography is so challenging that extra masks ( double patterning ) will be required. Will designs be technically and economically feasible? Panelists at the Design Automation...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Jun 6 2011
Page 1 of 1 (4 items)