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2.5D,DAC

  • DAC 2012 Panelists Tackle Tough Questions About 2.5D-ICs and 3D-ICs

    In a sometimes contentious panel session at the Design Automation Conference (DAC 2012) June 7, experts discussed and debated key technology and business questions around 2.5D-ICs and 3D-ICs. One overall takeaway is that 2.5D technology is very close to volume production, but true 3D stacking raises...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jun 14 2012
  • Two New Resources for 3D-IC Design

    Just in time for the Design Automation Conference (DAC), two new publications are providing fresh perspectives about 3D-IC design. First, the Global Semiconductor Alliance ( GSA ) has released a "3D-IC Design Tools and Services Tour Guide" for next week's DAC. Secondly, a new Cadence technical...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jun 2 2011
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