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 Community Search 

Page 1 of 4 (33 items) 1 | 2 | 3 | 4 | Next >
  • Re: How to make a program run as a non-blocking command?
    My pleasure. Thanks for giving me a brain teaser. Happy coding!
    Posted to PCB SKILL (Forum) by Tyler on Tue, Jul 15 2014
  • Re: How to make a program run as a non-blocking command?
    That's what I figured in terms of the shell pasting. Maybe one thing you could do is pipe the value to the windows (or linux, whatever OS you're using) clipboard, so you could just do Control-V to paste it where you want it? For instance, you could do the following from skill on a windows machine:    sprintf(myString "echo ...
    Posted to PCB SKILL (Forum) by Tyler on Tue, Jul 15 2014
  • Re: How to make a program run as a non-blocking command?
    When you register your command with axlCmdRegister, to make it run while other commands are up and running, set the command's type to general. You can look up the function documentation for all the options that can be set for the command, but a simple example would be:    axlCmdRegister("my_command" 'mySkillFunction ...
    Posted to PCB SKILL (Forum) by Tyler on Tue, Jul 15 2014
  • Re: Unable to delete a cavity
    What is the embedded status for the layer set to? You can check this in the Setup -> Embedded Layer Setup... form.If the layer isn't supposed to be a cavity containing layer, it should be set to "Not Embedded". If it's not, change it to that, and I believe the shape (which represents the filled parts of layer and will have ...
    Posted to IC Packaging and SiP Design (Forum) by Tyler on Wed, Jul 9 2014
  • Re: [skill code] Changing layer name
    I do not know of any function to do this. Most likely, you would need to write skill that would run a script / command shell commands to open the cross-section editor and update the name there, then close the form again. You could also submit an enhancement request to Cadence asking for a function to rename a conductor layer. Any reason ...
    Posted to IC Packaging and SiP Design (Forum) by Tyler on Sun, Jul 6 2014
  • Re: How to Move a Die Pin in Skill
     Since you mention you are using the symbol edit app mode to move the pins interactively, you might also consider using the the skill function "axlCompMovePin" to move the pins. That function is essentially the same as performing the action with the symbol edit app mode's move pins command. You should be able to find the doc for ...
    Posted to PCB SKILL (Forum) by Tyler on Thu, May 22 2014
  • Re: D.I.E format
    I believe this format is typically written out from the Virtuoso line of tools. So, you could generate one from a simple IC design from that tool if you want an example. I can't recall ever seeing a published format spec for it, though you could probably find one with Google. You've not mentioned if there's a strong reason to prefer ...
    Posted to IC Packaging and SiP Design (Forum) by Tyler on Fri, Dec 6 2013
  • Re: How can mcm file be converted to sip file....???
     16.5 SiP Layout XL includes menu items for importing and exporting MCM databases from SIP. They are located at:     File -> Export -> MCM and     File -> Import -> MCM If you don't see these, then you may have an old menu file, you may have modified your menu files unintentionally, etc. The commands ...
    Posted to IC Packaging and SiP Design (Forum) by Tyler on Tue, Oct 1 2013
  • Re: cross on Power and Ground pins
    From your description, it sounds like what you're seeing are the ratsnest markers for power/ground. You can:   - Set the NO_RAT property on the (set of) nets or   - Turn off display of the rats for the nets in question, Either would work fine for your purposes, I think. The choice is up to you, depending on whether you want to ...
    Posted to IC Packaging and SiP Design (Forum) by Tyler on Fri, Sep 6 2013
  • Re: Die height in stacked die
    When you run the View -> 3D Model command, in APD you must manually configure the die thicknesses and relative heights. On the 3D Layer Stackup tab, RMB on the layer number (e.g. "1") on the left side of the grid and select the Add option. When you set the type to "DIE", you'll be able to select the die refdes from the ...
    Posted to IC Packaging and SiP Design (Forum) by Tyler on Fri, Apr 12 2013
Page 1 of 4 (33 items) 1 | 2 | 3 | 4 | Next >