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 Community Search 

Page 1 of 3 (30 items) 1 | 2 | 3 | Next >
  • Re: Unable to delete a cavity
    What is the embedded status for the layer set to? You can check this in the Setup -> Embedded Layer Setup... form.If the layer isn't supposed to be a cavity containing layer, it should be set to "Not Embedded". If it's not, change it to that, and I believe the shape (which represents the filled parts of layer and will have ...
    Posted to IC Packaging and SiP Design (Forum) by Tyler on Wed, Jul 9 2014
  • Re: [skill code] Changing layer name
    I do not know of any function to do this. Most likely, you would need to write skill that would run a script / command shell commands to open the cross-section editor and update the name there, then close the form again. You could also submit an enhancement request to Cadence asking for a function to rename a conductor layer. Any reason ...
    Posted to IC Packaging and SiP Design (Forum) by Tyler on Sun, Jul 6 2014
  • Re: How to Move a Die Pin in Skill
     Since you mention you are using the symbol edit app mode to move the pins interactively, you might also consider using the the skill function "axlCompMovePin" to move the pins. That function is essentially the same as performing the action with the symbol edit app mode's move pins command. You should be able to find the doc for ...
    Posted to PCB SKILL (Forum) by Tyler on Thu, May 22 2014
  • Re: D.I.E format
    I believe this format is typically written out from the Virtuoso line of tools. So, you could generate one from a simple IC design from that tool if you want an example. I can't recall ever seeing a published format spec for it, though you could probably find one with Google. You've not mentioned if there's a strong reason to prefer ...
    Posted to IC Packaging and SiP Design (Forum) by Tyler on Fri, Dec 6 2013
  • Re: How can mcm file be converted to sip file....???
     16.5 SiP Layout XL includes menu items for importing and exporting MCM databases from SIP. They are located at:     File -> Export -> MCM and     File -> Import -> MCM If you don't see these, then you may have an old menu file, you may have modified your menu files unintentionally, etc. The commands ...
    Posted to IC Packaging and SiP Design (Forum) by Tyler on Tue, Oct 1 2013
  • Re: cross on Power and Ground pins
    From your description, it sounds like what you're seeing are the ratsnest markers for power/ground. You can:   - Set the NO_RAT property on the (set of) nets or   - Turn off display of the rats for the nets in question, Either would work fine for your purposes, I think. The choice is up to you, depending on whether you want to ...
    Posted to IC Packaging and SiP Design (Forum) by Tyler on Fri, Sep 6 2013
  • Re: Die height in stacked die
    When you run the View -> 3D Model command, in APD you must manually configure the die thicknesses and relative heights. On the 3D Layer Stackup tab, RMB on the layer number (e.g. "1") on the left side of the grid and select the Add option. When you set the type to "DIE", you'll be able to select the die refdes from the ...
    Posted to IC Packaging and SiP Design (Forum) by Tyler on Fri, Apr 12 2013
  • Re: Rotating blocks of pins
    You haven't mentioned what version of the tool you are using,but if you are in 16.5 or 16.6, you can use the "Symbol Edit" application mode. If your die has the LOCKED property on it, remove it and/or enable locked component editing through the user preferences menu.  Once you've done that, it's as simple as selecting ...
    Posted to IC Packaging and SiP Design (Forum) by Tyler on Fri, Apr 12 2013
  • Re: About interposer and spacer?
    There is both a text document solution, as well as a video walking you through spacer and interposer creation in the self-help area. I don't have exact links to them, but they should be reasonably easy to find with a keyword search.  Or, if you just want a basic, rectangular spacer, you can create it dynamically in SiP 16.6 from the Add ...
    Posted to IC Packaging and SiP Design (Forum) by Tyler on Mon, Jan 28 2013
  • Re: About interposer and spacer?
    Spacers are used to represent the physical spacer objects placed between dies in a die stack. The spacer provides separation between the two die, be it for electrical/thermal/etc. reasons or to ensure there is adequate vertical spacing so that, when the upper die is mounted above the lower die, the lower die's bond wires will not be ...
    Posted to IC Packaging and SiP Design (Forum) by Tyler on Mon, Jan 21 2013
Page 1 of 3 (30 items) 1 | 2 | 3 | Next >