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Blogger

Edward Malloy

15+ years in ASIC and IC design industry

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EDA360: Enlightenment for Silicon Test
At a macro level EDA360 is about driving the semiconductor industry toward sustainable differentiation. It represents a Cadence mission to help its customers' customers achieve industry leadership and profitability through enabling technologies, methodologies   Read More »
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Enabling Profitable Silicon Production: A Learning ‘Neural’ Network for Yield Ramp
It can not be overstated that the continued health of the chip industry hinges on profitable nanometer production, which depends on yield ramp and yield gap closure. The widening yield gap -- the difference between actual and predicted yield -- and its   Read More »
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Logic Design and Test Design: Do they need each other?
Cadence has moved from traditional methods and product offerings for silicon test in favor of a new direction, which answers the title question. In 2008, Cadence recognized that while the Encounter Test product had outstanding quality of results, ease   Read More »
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Power Management for Test: A Means of Addressing False Failures
Engineering teams are tracing test failures back to IR/voltage drop during test mode. These false failures are impacting yield, profitability. We consider this to be a power management issue for test mode and should be approached as early as front-end   Read More »
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Test (and Diagnostics) ... it is now a "Value Add" Operation (how are we measuring up?)
A quote from Defect and Fault Tolerance (DFT) 2008 Symposium Key Note Speaker – Phil Nigh, IBM, PhD Carnegie Mellon University: “The role of IC testing is changing – from being viewed as mainly a non-value (cost) operation – to   Read More »
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Quality of test patterns ...which metric is most effective for detecting defective chips?
With lower process geometries and exponential growth in test complexities, associated costs (risks), and aggressive DPPM goals (test escapes): 1) Are today's fault models sufficient to enable defect detection? What are the most common reasons for   Read More »
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