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 How to setup C4 Flip Chip Pads/Bumps in Encounter 

Last post Thu, Feb 20 2014 2:55 PM by Kari. 1 replies.
Started by stblock 14 Feb 2014 03:52 PM. Topic has 1 replies and 2193 views
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  • Fri, Feb 14 2014 3:52 PM

    • stblock
    • Not Ranked
    • Joined on Mon, Jan 20 2014
    • Posts 3
    • Points 45
    How to setup C4 Flip Chip Pads/Bumps in Encounter Reply

    We are packaging our chip with a flip-chip package (and c4 flip chip bonds).

     We don't have any CLASS BUMP files all we have is CLASS PAD AREAIO for the LVDS drivers and regular drivers.

     We have virtuoso layout files for a c4 pad.

     We were thinking we would need a bump cell too that would be used in Encounter however.

     

    We are wondering if we are missing a bump cell or is there some way to connect the c4 pad from Virtuoso to Encounter, and how this is done.

     

    Thank you 

     

    • Post Points: 20
  • Thu, Feb 20 2014 2:55 PM

    • Kari
    • Top 10 Contributor
    • Joined on Tue, Jul 15 2008
    • Cary, NC
    • Posts 693
    • Points 14,275
    Re: How to setup C4 Flip Chip Pads/Bumps in Encounter Reply

    If the foundy didn't provide a bump LEF along with the GDS (sometimes they do, sometimes they don't, it's worth asking), it's very easy to create one yourself. This is an example, you'll need to make sure everything matches your particular layout:

     

    VERSION 5.6 ;

    BUSBITCHARS "[" ;

    DIVIDERCHAR "/" ;

     

    MACRO bump_70N

     CLASS COVER BUMP ;

     FOREIGN bump_70N -47.0 -47.0 ;

     ORIGIN 47.0 47.0 ;

     SIZE 94.0 BY 94.0 ;

     PIN PAD

        DIRECTION INOUT ;

        USE SIGNAL ;

        PORT

          LAYER AP ;

            POLYGON -19.47 -47.0 19.47 -47.0 47.0 -19.47 47.0 19.47 19.47 47.0 -19.47 47.0 -47.0 19.47 -47.0 -19.47 ;

        END

      END PAD

    END bump_70N

     

    END LIBRARY

     

    • Post Points: 5
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Started by stblock at 14 Feb 2014 03:52 PM. Topic has 1 replies.