We are packaging our chip with a flip-chip package (and c4 flip chip bonds).
We don't have any CLASS BUMP files all we have is CLASS PAD AREAIO for the LVDS drivers and regular drivers.
We have virtuoso layout files for a c4 pad.
We were thinking we would need a bump cell too that would be used in Encounter however.
We are wondering if we are missing a bump cell or is there some way to connect the c4 pad from Virtuoso to Encounter, and how this is done.