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 IC Packaging Blog -- A wealth of information from the Cadence ICP team 

Last post Tue, Jan 29 2013 8:18 PM by BillAcito. 0 replies.
Started by BillAcito 29 Jan 2013 08:18 PM. Topic has 0 replies and 10389 views
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  • Tue, Jan 29 2013 8:18 PM

    • BillAcito
    • Top 150 Contributor
    • Joined on Mon, Jul 14 2008
    • Chelmsford, MA
    • Posts 52
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    IC Packaging Blog -- A wealth of information from the Cadence ICP team Reply

    Package Designers --

    I'd like to point out (and provide the link to) the Cadence IC Packaging blog. Recent posts from the ICP team highlight how to take advantage of the new 16.6 features, as well as overviews of our existing capabilities, and how our customers are leveraging our tools to design packages in the context of the die and PCB, shortening their design cycle time in the process. Subscribe and get email notifications as we highlight more capabilities throughout 2013.

    Regards, 

     Bill

     

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Started by BillAcito at 29 Jan 2013 08:18 PM. Topic has 0 replies.