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 can someone tell me why a bondpad is a three terminal device? 

Last post Tue, Jun 26 2012 6:44 AM by Quek. 1 replies.
Started by PeterXia 25 May 2012 01:00 PM. Topic has 1 replies.
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  • Fri, May 25 2012 1:00 PM

    • PeterXia
    • Not Ranked
    • Joined on Fri, May 18 2012
    • Posts 5
    • Points 70
    can someone tell me why a bondpad is a three terminal device? Reply

    Process: IBM CMOS8RF, 0.13 um.

    Tool: Cadence 514

     

    In this process, the bondpad symbol has three terminals, I/O, GND!, and SUB!. 

    Can someone tell me why it is so.

     Thanks a lot !!
    Filed under:
    • Post Points: 20

  • Tue, Jun 26 2012 6:44 AM

    • Quek
    • Top 10 Contributor
    • Joined on Wed, Oct 14 2009
    • Singapore, 00-SG
    • Posts 960
    • Points 14,580
    Re: can someone tell me why a bondpad is a three terminal device? Reply
    Hi Peter

    The GND! and SUB! terminals are most probably for shielding the bondpad for better performance at high frequencies. You can take a look at the following link. There is a bit of discussion on this.

    http://www.scribd.com/doc/97178561/48/Bond-pad-effect


    Best regards
    Quek
    • Post Points: 5
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Started by PeterXia at 25 May 2012 01:00 PM. Topic has 1 replies.