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 PCB Materials 

Last post Thu, Dec 5 2013 9:13 PM by pcbapc. 1 replies.
Started by annhqew 19 Nov 2013 11:02 PM. Topic has 1 replies and 5392 views
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  • Tue, Nov 19 2013 11:02 PM

    • annhqew
    • Not Ranked
    • Joined on Wed, Nov 20 2013
    • shenzhen, Guangdong
    • Posts 2
    • Points 25
    PCB Materials Reply

    FR-4:

    FR-4 is the NEMA grade designation for glass reinforced epoxy laminate sheets, tubes, rods and printed circuit boards (PCB). FR-4 is made of woven fiberglass cloth with an epoxy resin binder that is flame resistant (self-extinguishing). Note that FR-4 is a specification – not a product in itself.
    FR-4 glass epoxy is a popular and versatile high pressure thermoset plastic laminate grade with good strength to weight ratios. With near zero water absorption, FR-4 is most commonly used as an electrical insulator possessing considerable mechanical strength. The material is known to retain its high mechanical values and electrical insulating qualities in both dry and humid conditions. These attributes, along with good fabrication characteristics, lend utility to this grade for a wide variety of electrical and mechanical applications.
    FR-4 is the primary insulating backbone upon which the vast majority of rigid printed circuit boards (PCBs) are produced. A thin layer of copper foil is laminated to one, or both sides of an FR-4 glass epoxy panel. These are commonly referred to as “copperclad laminates.”
    FR-4 copper-clad sheets are fabricated with circuitry etched into copper layers to produce printed circuit boards. More sophisticated and complex FR-4 printed circuit boards are produced in multiple layers, aka “multilayer circuitry”.
    FR-4 is a worldwide standard PCB dielectric used in quality PCBs. FR-4 is similar to CEM-3 and is part of a family of laminates of varying specification and cost. See also printed circuit board.

    Teflon(PTFE), Rogers, Taconic:

    PTFE is used as non-stick coating for commercial applications due to its inert molecular structure. Its surface can be “roughened” only through drastic measures. PTFE/woven glass base materials are not surrounded by the myth of something exotic anymore. Asecured manufacturing and defined processing to pcbs are the guarantors for it. Rapid growth ofapplications operating at high frequencies demands a material availability with proven performance over many years. These facts are both given with PTFE/woven glass base materials.
    In Rogers’ Advanced Circuit Materials Division, they manufacture high frequency laminates for applications in the wireless base station, aerospace and defense, automotive, high-speed digital and advanced chip packaging industries. All of products are manufactured in an ISO-9001:2008 certified facility with “ahead of the curve” process technology.

    Rogers manufacture an extensive selection of high frequency laminates for a wide range of applications. Among these are materials with a range of dielectric constants, low dissipation factor,temperature stability, and controlled mechanical properties and some materials priced for low-cost commercial applications.

    Taconic Advanced Dielectric Division manufactures PTFE/woven glass base materials for microwave, RF and high speed digital applications. Applications include LNAs, LNBs, PCS/PCN antennas, GSM and UMTS antennas, power amplifiers, filters, passive components, automotive cruise control, aerospace guidance telemetry, phase array radar, etc.

    PTFE based materials are not included in any current or future regulatory guidelines or bans. The outstanding characteristics of PTFE including thermal stability, flame resistance, electrical properties and durability of electrical properties render this plastic as the top candidate for printed circuit boards.

    Flexible Material:

    PTFE is used as non-stick coating for commercial applications due to its inert molecular structure. Its surface can be “roughened” only through drastic measures. PTFE/woven glass base materials are not surrounded by the myth of something exotic anymore. Asecured manufacturing and defined processing to pcbs are the guarantors for it. Rapid growth ofapplications operating at high frequencies demands a material availability with proven performance over many years. These facts are both given with PTFE/woven glass base materials.
    In Rogers’ Advanced Circuit Materials Division, they manufacture high frequency laminates for applications in the wireless base station, aerospace and defense, automotive, high-speed digital and advanced chip packaging industries. All of products are manufactured in an ISO-9001:2008 certified facility with “ahead of the curve” process technology.

    Rogers manufacture an extensive selection of high frequency laminates for a wide range of applications. Among these are materials with a range of dielectric constants, low dissipation factor,temperature stability, and controlled mechanical properties and some materials priced for low-cost commercial applications.

    Taconic Advanced Dielectric Division manufactures PTFE/woven glass base materials for microwave, RF and high speed digital applications. Applications include LNAs, LNBs, PCS/PCN antennas, GSM and UMTS antennas, power amplifiers, filters, passive components, automotive cruise control, aerospace guidance telemetry, phase array radar, etc.

    PTFE based materials are not included in any current or future regulatory guidelines or bans. The outstanding characteristics of PTFE including thermal stability, flame resistance, electrical properties and durability of electrical properties render this plastic as the top candidate for printed circuit boards.

    Metal Base Material:

    Metal base PCB board contains Aluminum PCB,Copper PCB,Iron PCB.Aluminum PCB is a unique metal-based copper clad laminate,it has good thermal conductivity,electrical insulation and machining performance.
    Aluminum PCB is one of metal-based pcb,including copper foil,thermal insulating layer and metal substrate,its structure divide into three layers:
    1. Circuit layer: the equivalent of an ordinary PCB,copper thickness from 1oz to 10oz.
    2. Insulation layer: Insulation is a layer of thermal insulating material with low thermal resistance.Thickness: 0.003 “to 0.006″ inch is the aluminum pcb core technology.
    3. Based Layer: a metal substrate,usually aluminum or copper may be chosen.
    Features:
    ● Use of surface mount technology (SMT);
    ● The circuit design of the thermal diffusion of highly effective treatment;
    ● Reduce product operating temperature,increase the power density and reliability,extended product life;
    ● Smaller footprint,lower hardware and assembly costs;
    ● Replace the fragile ceramic base pcb,better mechanical durability.
    As an advocate to promote energy-saving lamps and colorful energy-saving LED lights are very popular by the market, the aluminum pcb used in LED lights have begun a large-scale applications.

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    • Post Points: 20
  • Thu, Dec 5 2013 9:13 PM

    • pcbapc
    • Not Ranked
    • Joined on Tue, Dec 3 2013
    • ADDISON, IL
    • Posts 5
    • Points 40
    Re: PCB Materials Reply

     Your Post is great.
    Here are also a some useful tips for generating a quality Printed Circuit board manufacturing You can use E-Cam Stations to view Customer Drawing and Specs and 100% DRC check prior to Manufacturing.   NC-Cam for Engineering and Programming.

    American Progressive Circuits,Inc, 1772 Armitage Court ADDISON IL 60101 http://www.pcbapc.com
    • Post Points: 5
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Started by annhqew at 19 Nov 2013 11:02 PM. Topic has 1 replies.