Home > Community > Forums > IC Packaging and SiP Design > DIE/ BGA rotation, before and after generation

Email

* Required Fields

Recipients email * (separate multiple addresses with commas)

Your name *

Your email *

Message *

Contact Us

* Required Fields
First Name *

Last Name *

Email *

Company / Institution *

Comments: *

 DIE/ BGA rotation, before and after generation 

Last post Tue, May 15 2012 1:16 PM by Tyler. 2 replies.
Started by yitch 15 May 2012 12:38 AM. Topic has 2 replies and 4289 views
Page 1 of 1 (3 items)
Sort Posts:
  • Tue, May 15 2012 12:38 AM

    • yitch
    • Not Ranked
    • Joined on Tue, May 15 2012
    • Posts 4
    • Points 80
    DIE/ BGA rotation, before and after generation Reply

    Hi, does anyone know how to rotate the die or the bga before and after rotation? Currently working on a stacked die package. Would prefer to know how to do it after generation, but for completeness if there is a method to do it before that would be great as well.

     

    Thanks! 

    • Post Points: 35
  • Tue, May 15 2012 6:47 AM

    • BillAcito
    • Top 150 Contributor
    • Joined on Mon, Jul 14 2008
    • Chelmsford, MA
    • Posts 52
    • Points 830
    Re: DIE/ BGA rotation, before and after generation Reply

    I'm not sure what you mean by "before generation", but once placed:

    In SiP, the Die Stack Editor tool has a rotation value for each die in the DIE tab.

    In APD, you can select the symbol, RMB, and select "Spin".

     

    Bill

    • Post Points: 5
  • Tue, May 15 2012 1:16 PM

    • Tyler
    • Top 500 Contributor
    • Joined on Thu, Jul 17 2008
    • Tempe, AZ
    • Posts 35
    • Points 520
    Re: DIE/ BGA rotation, before and after generation Reply

    BillAcito has it right. While some of the die and BGA creation tools, like the BGA/Die text in wizards, allow you to specify the rotation when the component is created, that is not available in all flows. What is available is, after placement, the ability to rotate, move, and mirror the component. You can do this using:

    Edit -> Move (allows for rotation as well as movement; available for both APD and SiP users)
    Edit -> Spin (allows for rotation only; available for both APD and SiP users).
    Edit -> Diestacks... (allows for rotation, movement, and pad layer change; available only for SiP users).

    I believe stacked die packages are only supported in the SiP products, so with luck that is what you are using. If so, the die stack editor tool is the most comprehensive, as it also gives you options for what to do with the bond shell if it exists (stretch the wires to the new pin locations vs. move the wires, fingers, and die as a single unit) and the ability to change the ordering of the dies in the stack by changing the layer that each die is placed on. 

    - Tyler

    • Post Points: 5
Page 1 of 1 (3 items)
Sort Posts:
Started by yitch at 15 May 2012 12:38 AM. Topic has 2 replies.