Using OrCAD PCB Designer v16.3.S009
I would like to know how to control the copper seed point on a particular symbol, but not the whole design.
I have a shield over a part that has 4 pads that are all GND. This part is on the top layer which has a GND copper pour dynamic shape. When I smooth the shapes, it makes very odd angled connections between the pads and the pour even though my global dynamic shape thermal relief parameters are set to orthogonal. It puts in a 5 mil relief around the pad except for 3 points at which it runs a cline from the origin of the pad to the pour. I would like to allow the copper pour to flood to these pads without a thermal relief and therefore no odd angled lines. However, I don't want this to happen to all of the parts on the designs that connect to GND. I like those the way they are.
Any ideas? Thanks.