Once the SIP design is completed .. I would like to know
1)What Are the files I need to export otherthan solder mask, conductor layers( TOP, layer2, layer3, bottom) and drill file.. ??
2)How to give information about wirebond detalis( like profile & routing) to manufacturer..??
3) Is Gerber format is preferred by package manufacturer..??
4) Any tool to validate the output manufacturing data ??( like Valor & Cam350 in PCB domain)
Thanks in Advance