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 Moving Wire Bond in APD16.2 results disconnect Wire and it's Bond Finger 

Last post Wed, Apr 29 2009 8:05 PM by Tyler. 7 replies.
Started by Alice 29 Apr 2009 02:29 AM. Topic has 7 replies.
Page 1 of 1 (8 items)
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  • Wed, Apr 29 2009 2:29 AM

    • Alice
    • Top 500 Contributor
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    • Bayan Lepas, Pulau Pinang
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    Moving Wire Bond in APD16.2 results disconnect Wire and it's Bond Finger Reply

    Hi all,

     I face problem when I want to move the wire bond in APD16.2. After the first nove of the wire bond, when I want to make second time move, the Bond Fingers will shove togather but the wires stay as it is. It seems like a disconnect between BF and wires. Does anyone know how to solve this ?

     Thanks,

    Alice
    • Post Points: 35

  • Wed, Apr 29 2009 3:45 AM

    • JacobL
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    • Järfälla, 00-SE
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    Re: Moving Wire Bond in APD16.2 results disconnect Wire and it's Bond Finger Reply

    How do you implement the bond wires? I use a sub-class under package geometry. It is then not "connected" more than visually. To move a bond wire, I then have to re-draw it.

    Jacob
    • Post Points: 20

  • Wed, Apr 29 2009 9:45 AM

    • BillAcito
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    • Chelmsford, MA
    • Posts 45
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    Re: Moving Wire Bond in APD16.2 results disconnect Wire and it's Bond Finger Reply

     Which "move" are you using? Edit-->Move, or Wirebond RMB Move (the correct one)?

    • Post Points: 20

  • Wed, Apr 29 2009 5:24 PM

    • Alice
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    Re: Moving Wire Bond in APD16.2 results disconnect Wire and it's Bond Finger Reply
    Hi Bil,

    I used Select>Click on the wire bond > Move. Also, I tried Edit-> Move. Both methods gave me same problem. This issue will happen after I intend to move the same wire bond for the second time.

    Pls advice.

    Thanks,
    Alice
    • Post Points: 20

  • Wed, Apr 29 2009 5:50 PM

    • Alice
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    Re: Moving Wire Bond in APD16.2 results disconnect Wire and it's Bond Finger Reply

    Hello Jacob,

    I think you need to on the wire bond layers. Color>Bond Wire Profiles> check on the profile .

    But first, you will need to set up the wire bond profile before do connection.

     

    Regards,

    Alice

     
    • Post Points: 5

  • Wed, Apr 29 2009 7:34 PM

    • Tyler
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    • Tempe, AZ
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    Re: Moving Wire Bond in APD16.2 results disconnect Wire and it's Bond Finger Reply

    I have heard of a similar issue before in a few designs. Are your bond wires quite short? What units is your design in? I know it might sound strange, but if they aren't in microns, try changing to microns and doing the move again. This might fix your issue. I know it has on some designs that I have seen. 

    If you've already moved the wirebonds and they've become disconnected, 16.2 has the Tools -> Package Design Integrity command. Under the wirebond folder, there is a check which will look for bond wires which have become disconnected from their finger (or pin) and will try to reconnect them for you. I would recommend trying that out if you get a second. It's not a solution, but it will usually be able to fix the design up for you so that the wirebond move command works properly again. 

    • Post Points: 20

  • Wed, Apr 29 2009 7:56 PM

    • Alice
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    Re: Moving Wire Bond in APD16.2 results disconnect Wire and it's Bond Finger Reply

    Hello Tyler,

    I did as per your recommendation, and it works! How great it is!! Also, is true if wire is long enought I won't see this problem.

     I really don't understand why need to have unit as microns to make the Design Intergrity WB checks work. It seems like a major issue for APD 16.2. I need to run Intergrity checks everytime there's disconnect moved WB. I did feedback to Cadence and the feedback is RND will look in to it.

    Anyway, really appreaciate your temporary solution as I may proceed with the design.

    Thank you very much. =)

    Regards,

    Alice 

     

     

     
    • Post Points: 20

  • Wed, Apr 29 2009 8:05 PM

    • Tyler
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    • Tempe, AZ
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    Re: Moving Wire Bond in APD16.2 results disconnect Wire and it's Bond Finger Reply

    I'm glad to hear it works! That's great, Alice!

    Also, I'm reasonably sure that the design integrity check bug is scheduled for fix very soon. Last I talked to R&D, the fix was ready, but needed to be built into the next patch for customer release, so we should see it available in the next 2-3 weeks or so. 

    The disconnect on moving the wirebond is still actively being looked at, so I don't know when that will be ready for release.

    • Post Points: 5
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Started by Alice at 29 Apr 2009 02:29 AM. Topic has 7 replies.