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 EDN blogger talks about Allegro 16.2 release 

Last post Mon, Aug 18 2008 4:34 PM by Dieds. 0 replies.
Started by Dieds 18 Aug 2008 04:34 PM. Topic has 0 replies and 4678 views
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  • Mon, Aug 18 2008 4:34 PM

    • Dieds
    • Top 500 Contributor
    • Joined on Fri, Jun 13 2008
    • San Jose, CA
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    EDN blogger talks about Allegro 16.2 release Reply
    Of interest to readers of this forum. An EDN blogger today talks about our  SPB 16.2 release.  

    “Cadence is underlining the observation that no longer can we regard PCB design as somehow a simple process, and package design as a mechanical problem,” writes EDN executive Editor Ron Wilson. 

    “With passive components migrating off of silicon dice and into packages or boards, with high-density three-dimensional structures that are electrically part of the circuit design, and with even higher speeds and densities on the horizon, this is a new world. The next big question is how the tools will track the migration from today's stack-die, wire-bonded SiPs to the true 3D IC concepts now working in labs around the world.”

    Read the entire blog post here.
    Cadence community manager
    • Post Points: 5
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Started by Dieds at 18 Aug 2008 04:34 PM. Topic has 0 replies.